Low intrinsic thermal conductivity
coefficients (λ) of polyimide
(PI) films limit their application in heat-prone flexible electronics.
By optimizing the liquid crystal range to fit the curing temperature,
novel kinds of intrinsically highly thermally conductive liquid crystalline
PI (LC-PI) films are fabricated. When the molar ratio of 4,4′-diaminodiphenyl
ether (ODA) to 1, 4-bis(4-aminophenoxy)benzene (TPE-Q) is 1:3 (sample
no. IV), liquid crystal range of preLC-PIIV films is 272∼388 °C, including curing temperature of
350 °C. The LC-PIIV films cured in liquid crystal
range retain liquid crystal texture to room temperature, and the in-plane
λ (λ∥) and through-plane λ (λ⊥) at room temperature reach 2.11 W/(m·K) and 0.32
W/(m·K), respectively, significantly higher than λ∥ (0.77 W/(m·K)) and λ⊥ (0.15 W/(m·K)) of LC-PII films which are cured out
of the liquid crystal range. Meanwhile, LC-PIIV films possess
excellent mechanical and thermal properties, showing application prospects
in high-heating flexible electronics.