2017 IEEE International Solid-State Circuits Conference (ISSCC) 2017
DOI: 10.1109/isscc.2017.7870334
|View full text |Cite
|
Sign up to set email alerts
|

12.2 A 7nm FinFET SRAM macro using EUV lithography for peripheral repair analysis

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
6
0

Year Published

2017
2017
2024
2024

Publication Types

Select...
5
1
1

Relationship

0
7

Authors

Journals

citations
Cited by 15 publications
(6 citation statements)
references
References 3 publications
0
6
0
Order By: Relevance
“…I PGL and I PGR are the currents flowing through the PGL and PGR during the write operation, respectively. The V CS is determined by the charge sharing between the floated CV DD and BL precharged to half-V DD by the CSBP, as shown in Equation (10). When the CSWD is used with the conventional BP, the V CS is 0 since the voltages of precharged BL and CV DD are the same as V DD .…”
Section: A Structure and Operationmentioning
confidence: 99%
See 1 more Smart Citation
“…I PGL and I PGR are the currents flowing through the PGL and PGR during the write operation, respectively. The V CS is determined by the charge sharing between the floated CV DD and BL precharged to half-V DD by the CSBP, as shown in Equation (10). When the CSWD is used with the conventional BP, the V CS is 0 since the voltages of precharged BL and CV DD are the same as V DD .…”
Section: A Structure and Operationmentioning
confidence: 99%
“…1(b). For improving writability, the negative bitline (NBL) [5], [7], [10], [12], [14]- [16], transient cell supply collapse (TVC) [4], [8], [13]- [17], transient cell ground bump (TGB) [18]- [20], or wordline overdrive (WLOD) WA [9], [12], [21], [22] is used. Although the various RA and WA techniques reduce the V MIN , reducing the energy consumed in the assist circuit is still challenging.…”
Section: Introductionmentioning
confidence: 99%
“…The fact that the fabrication technologies for semiconductor devices continue to progress is also beneficial to charge qubits. Now, the cell size of advanced 2D NAND flash memory [36][37][38] is less than 15 nm 39,40 , and the transistor size are entering into the quantum region below 7 nm [41][42][43] . The disadvantage of the charge qubit's short coherence time is expected to be reduced as transistor size decreases.…”
Section: Introductionmentioning
confidence: 99%
“…The fundamental idea is that we will be able to regard a small FG cell in the single-electron region as a charge qubit. The size of the current FG NAND flash memory is 15 nm 39,40 , but it can be shrunk to less than 7 nm [41][42][43] . When the doping concentration of electrons is 5 × 10 18 cm −3 , the number of electrons in a volume of 10×10×30 nm 3 is about 15 and countable.…”
Section: Introductionmentioning
confidence: 99%
“…The fundamental idea is that we will be able to regard a small FG cell in the single-electron region as a charge qubit. Now the size of the FG NAND flash memory is 15 nm 17,18 , and the size can shrink to beyond 7 nm [19][20][21] . In the flash memory with 15 nm cell, singleelectron effects can be observed at room temperature 22 .…”
Section: Introductionmentioning
confidence: 99%