25.4 A 500Mb/s 200pJ/b die-to-die bidirectional link with 24kV surge isolation and 50kV/µs CMR using resonant inductive coupling in 0.18µm CMOS

Mukherjee, Sritama; Bhat, Anoop Narayan; Shrivastava, Kumar Anurag; Bonu, Madhulatha; Scheibe, Benjamin; Venugopal, Gunasekaran; Thiagarajan, Ganesan; Abhijit, Patki; Malakar, Jhankar; Krishnapura, Nagendra

doi:10.1109/isscc.2017.7870447

Cited by 16 publications

(20 citation statements)

References 2 publications

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“…The simplified block-diagram of a package-scale galvanic isolator based on RF planar coupling is shown in Figure 3 with reference to a single physical channel. Due to the extremely low magnetic coupling coefficient, k, between the transmitter (TX) and receiver (RX) micro-antennas, L TX, and L RX , carrier-based narrowband communication is mandatory to achieve significant performance in terms of both data rate and CMTI [16][17][18]. Typically, data transmission adopts on-off keying (OOK) pulse width modulation (PWM) of the RF carrier.…”

Section: Chip-scale Isolation Vs Package-scale Isolationmentioning

confidence: 99%

“…However, c spacing must be more than twice the DTI to achieve a TX-to-RX rejection better dB. Therefore, it is mandatory to exploit different RF resonance frequencies (i.e., fR ration) for each channel [16]. Typically, galvanically isolated interfaces require multi-channel capability, which can be implemented by multiplexing different data channels on the same physical link, provided that a sufficiently high data rate is available [11,14].…”

Section: Chip-scale Isolation Vs Package-scale Isolationmentioning

confidence: 99%

“…However, channel spacing must be more than twice the DTI to achieve a TX-to-RX rejection better than 15 dB. Therefore, it is mandatory to exploit different RF resonance frequencies (i.e., f RF separation) for each channel [16].…”

Section: Chip-scale Isolation Vs Package-scale Isolationmentioning

confidence: 99%

“…Frequency A final consideration is about the TX antenna spiral layout, which has to comply with the adopted oscillator topology. Indeed, a simple not symmetric spiral can be used in a complementary cross-coupled oscillator (see Figure 4b), as in [16,18]. On the other hand, if a D-class oscillator is topology is mandatory to ensure the central tap connection for the supply voltage, V DD .…”

Section: On-chip Micro-antenna Design Guidelinesmentioning

confidence: 99%

“…A promising approach is represented by the package-scale isolation, which consists in building up a galvanically isolated system by using standard packaging/assembling techniques along with radiofrequency (RF) coupling between two on-chip micro-antennas. A high-potential solution exploits the near-field coupling between two micro-antennas integrated on two side-by-side co-packaged chips, taking advantage of standard molding compound as isolation barrier [16][17][18]. This paper presents an optimized design procedure of on-chip micro-antennas for package-scale galvanic isolators based on RF coupling.…”

Section: Introductionmentioning

confidence: 99%

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Package-Scale Galvanic Isolators Based on Radio Frequency Coupling: Micro–Antenna Design

2022

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This paper presents the design of on-chip micro-antennas for package-scale galvanic isolators based on RF planar coupling. A step-by-step design procedure is proposed, which aims at the maximization of the weak electromagnetic coupling between the RX and TX antennas integrated on side-by-side co-packaged chips to enable both high isolation rating and common-mode transient immunity thanks to the high dielectric strength and low capacitive parasitics of a molding compound-based galvanic barrier, respectively. Micro-antenna design guidelines are drawn, highlighting the main relationship between coil coupling performance and their layout parameters, which are often in contrast with respect to traditional integrated inductor ones.

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Section: Chip-scale Isolation Vs Package-scale Isolationmentioning

confidence: 99%

Section: Chip-scale Isolation Vs Package-scale Isolationmentioning

confidence: 99%

Section: Chip-scale Isolation Vs Package-scale Isolationmentioning

confidence: 99%

Section: On-chip Micro-antenna Design Guidelinesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Package-Scale Galvanic Isolators Based on Radio Frequency Coupling: Micro–Antenna Design

2022

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A GaN-Integrated Galvanically Isolated Data Link Based on RF Planar Coupling With Voltage Combining for Gate-Driver Applications

Spataro,

Ragonese,

Spina

et al. 2024

IEEE Access

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In this paper the design of a galvanically isolated data link for gate-driver applications in GaN technology is presented. The isolation channel exploits the near-field RF planar coupling between micro-antennas placed on two side-by-side co-packaged chips. Adopted package-scale isolation has several benefits i.e., the applicability to any integration technology and the capability to achieve both very high isolation rating and common-mode transient immunity by means of a proper distance between chips. The isolation channel adopts an RF carrier of 2 GHz that is modulated by a PWM signal. For the first time, a voltage-combining approach based on multiple antennas has been explored in a galvanically isolated data link. Specifically, the TX front-end consists of two capacitively coupled RF oscillators connected to two differential antennas designed for voltage combining. The RX front-end combines the transmitted RF signals by means of one differential antenna and extracts the PWM signal by means of a rectifier and an amplifier with a dynamic offset compensation. Emphasis is given to the design of micro-antennas, which is essential to minimize channel loss. The data link was tested by using a chip-on-board assembly to validate the proposed approach. The overall current consumption was lower than 4 mA for a PWM signal of 500 kHz and a duty cycle of 50%.INDEX TERMS Class D oscillator, current-reuse, dynamic offset compensation, galvanic isolation, GaN technology, gate driver, on-chip antennas, voltage-combining.

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Analysis of Signal Transmission through Time-Varying Inductively Coupled Links

Krishnapura

2024

2024 IEEE International Symposium on Circuits and Systems (ISCAS)

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25.4 A 500Mb/s 200pJ/b die-to-die bidirectional link with 24kV surge isolation and 50kV/µs CMR using resonant inductive coupling in 0.18µm CMOS

Cited by 16 publications

References 2 publications

Package-Scale Galvanic Isolators Based on Radio Frequency Coupling: Micro–Antenna Design

Package-Scale Galvanic Isolators Based on Radio Frequency Coupling: Micro–Antenna Design

A GaN-Integrated Galvanically Isolated Data Link Based on RF Planar Coupling With Voltage Combining for Gate-Driver Applications

Analysis of Signal Transmission through Time-Varying Inductively Coupled Links

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