26.3: Effect of Seed Particles on Exaggerated Grain Growth of Redeposited MgO Layer during Accelerated Discharge Testing of AC‐PDPs

Abstract

Reconstruction and exaggerated grain growth (EGG) behaviors of redeposited MgO layer were observed and analyzed theoretically with the addition of dopant and MgO seed particle. The reconstruction and EGG are closely correlated with the driving force for nucleation and growth, interface energy and initial size distribution of MgO protective layer and this is believed to be caused by the formation of charged clusters in the plasma spaces during discharge in AC-PDPs.

Effects of Surface and Plate-Gap Discharges on Panel-Aging Characteristics in Alternating-Current Plasma Display Panel

“…3(b) and Table II, the MgO surface morphologies and roughnesses for both bus and ITO electrodes were observed to be almost the same and the total panel-aging process time was about 8 h. We have reported that continuous ion bombardment on the MgO thin film causes the surface morphology and roughness of the MgO thin film to increase. 15,[20][21][22][23][24] The surface morphologies and roughnesses in the case of using only the surface discharge of Fig. 3(a) and Table II meant that the MgO surface on the ITO electrode was struck by many more ions than that on the bus electrode, implying that the strong discharge did not spread towards the bus electrode owing to the confined strong surface discharge within the ITO electrode.…”

51.1: Invited Paper: High Luminous Efficacy and Low Power Consumption Plasma TV

“…Figure 6 shows the variation in the morphology of MgO protective layer by the addition of functional layer (MgO seed particle) before and after discharge in a PDP cell. The reconstruction and exaggerated grain growth (EGG) are strongly influenced by the addition of functional layer to the surface of protective layer [4]. By controlling reconstruction behavior using functional layer, the stable driving and long-term stability can be maintained and thus, reconstruction behavior is considered to be one of the most important parameters for reliability.…”