2010
DOI: 10.1587/transele.e93.c.1218
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2D Device Simulation of AlGaN/GaN HFET Current Collapse Caused by Surface Negative Charge Injection

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Cited by 3 publications
(2 citation statements)
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“…Current collapse in AlGaN/GaN heterostructure FETs (HFETs) is also considered to be caused by negative charges appearing on the drain side of the i-GaN region when a high drain bias is applied. There are several possible mechanisms of negative-charge formation, such as electron injection at the AlGaN surface, 3) but one mechanism is that entailing deep traps in the i-GaN layer. In such cases, the potential profiles are similar to those in side-gating effects, namely, a negative charge appears on the positive-bias side of the i-GaN region, that is, the drain.…”
Section: Introductionmentioning
confidence: 99%
“…Current collapse in AlGaN/GaN heterostructure FETs (HFETs) is also considered to be caused by negative charges appearing on the drain side of the i-GaN region when a high drain bias is applied. There are several possible mechanisms of negative-charge formation, such as electron injection at the AlGaN surface, 3) but one mechanism is that entailing deep traps in the i-GaN layer. In such cases, the potential profiles are similar to those in side-gating effects, namely, a negative charge appears on the positive-bias side of the i-GaN region, that is, the drain.…”
Section: Introductionmentioning
confidence: 99%
“…7) Developing appropriate measures to achieve actual collapse-free operation, therefore, requires a thorough understanding of the complex interplay of trapped charges and the internal electric field in AlGaN=GaN HEMTs. [8][9][10][11] Electroluminescence (EL) spectroscopy is an established means of identifying high-field regions in compound semiconductor devices. [12][13][14][15][16][17] EL in AlGaN=GaN HEMTs is usually associated with intervalley transitions 18,19) or bremsstrahlung 20,21) involving hot electrons generated by high electric field.…”
mentioning
confidence: 99%