The side-gating effect was demonstrated in AlGaN/GaN heterostructure field effect transistors (HFETs) for the first time. Using 10-µm-thick i-GaN buffer layers, drain currents decreased significantly with the application of a negative bias on a side gate 8 µm away from the FET. The transient responses with LED illumination demonstrated half-recovery condition that can be interpreted as a negative-charge redistribution through a hole emission from traps. The application of a positive side-gate bias confirmed the half-recovery mechanism. From the temperature variation measurements, the trap energy level is estimated to be 0.76 eV from the valence band with a hole capture cross section of approximately 4×10-16 cm2. All these results indicate that the side-gating effect is caused by hole traps in the i-GaN layer, which is in accord with the Shockley–Read–Hall model of deep traps.