3-D FEM Investigation on Electrical Ruggedness of Double-Sided Cooled Power Modules

Scognamillo, Ciro; Catalano, Antonio Pio; Trani, Roberto; d’Alessandro, V.; Castellazzi, Alberto

doi:10.1109/eurosime48426.2020.9152740

Cited by 4 publications

(1 citation statement)

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“…An insulating gel is poured over the entire top surface in order (i) to increase the dielectric integrity and (ii) to avoid undesirable effects such as partial discharge and dielectric breakdown [24]. For the PM under analysis, a 5 mm-high silicon gel produced by Sylgard was considered [25]. Since the module PADs are covered by the insulating gel, Al vertical connectors are required to make them accessible.…”

Section: Power Module Under Investigationmentioning

confidence: 99%

Compact Modeling of a 3.3 kV SiC MOSFET Power Module for Detailed Circuit-Level Electrothermal Simulations Including Parasitics

et al. 2021

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In this paper, an advanced electrothermal simulation strategy is applied to a 3.3 kV silicon carbide MOSFET power module. The approach is based on a full circuital representation of the module, where use is made of the thermal equivalent of the Ohm’s law. The individual transistors are described with subcircuits, while the dynamic power-temperature feedback is accounted for through an equivalent thermal network enriched with controlled sources enabling nonlinear thermal effects. A synchronous step-up DC-DC converter and a single-phase inverter, both incorporating the aforementioned power module, are simulated. Good accuracy was ensured by considering electromagnetic effects due to parasitics, which were experimentally extracted in a preliminary stage. Low CPU times are needed, and no convergence issues are encountered in spite of the high switching frequencies. The impact of some key parameters is effortlessly quantified. The analysis witnesses the efficiency and versatility of the approach, and suggests its adoption for design, analysis, and synthesis of high-frequency power converters in wide-band-gap semiconductor technology.

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Section: Power Module Under Investigationmentioning

confidence: 99%