Abstract-We fabricated top-gate and self-aligned In-Ga-Zn-O thin-film transistors (TG-SA IGZO TFTs) at a maximum process temperature of 150 °C using a coatable organic gate insulator (OGI). By forming a damage and contamination-free interface between the IGZO channel and OGI, and forming low-resistive source/drain (S/D) regions by Al reaction method, we achieved good TFT properties, such as field effect mobility of 9.8 cm 2 /Vs, subthreshold swing of 0.21 V/dec., and hysteresis of 0.3 V, with minimizing a parasitic capacitance. Although the TFT showed an abnormal degradation behavior under positive gate bias stress testing in an ambient air, it was suppressed by forming an additional organic passivation layer.Index Terms-Indium-gallium-zinc-oxide (IGZO), Organic gate insulator (OGI), Self-aligned structure, Thin-film transistor (TFT).