37–39 GHz Vertically-Polarized End-fire 5G Antenna Array featuring Electrically Small Profile

Park, Junho; Choi, Dooseok; Hong, Wonbin

doi:10.1109/apusncursinrsm.2018.8608996

Cited by 14 publications

(11 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The use of these mmWave bands for 5G systems can enable high data rates, and thus antennas with large bandwidths are required to support these high data rates. Several LTCC-based 5G AiP designs have been demonstrated in literature [19][20][21][22][23]. For example, in [20], two 38 GHz quasi-Yagi antennas have been implemented in one LTCC substrate to achieve two orthogonal horizontal polarizations, as shown in Figure 7.7.…”

Section: (1) 5g Aipmentioning

confidence: 99%

Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms

Shamim

Zhang

2020

Antenna‐in‐Package Technology and Applications

View full text Add to dashboard Cite

Consistent with the SoP concept, AiP is an antenna that is realized on the package of the driving circuit [2]. There are many advantages of AiP that are beneficial for RF systems, the most prominent being the ability of realizing multilayer (vertically integrated) antennas that reduce the overall size of the system. Further, no separate printed circuit boards (PCB) for antenna realization or connections to an external antenna board are required, increasing compactness and cost savings. Finally, efficient antennas can be realized in low loss packaging technologies, particularly at mmWave bands. These aspects are discussed in detail in the coming sections. Low-temperature co-fired ceramic (LTCC) is one of the mainstream technologies for AiP designs. This chapter focuses on AiP designs in LTCC technology. Before moving on to details of AiP design, LTCC technology is introduced in the next section. Section II LTCC Technology LTCC is a multilayer ceramic tape system, which has recently gained popularity not only as a packaging technology but also as an efficient medium to realize passive components. In this section, we first briefly introduce the LTCC technology and then discuss the advantages and issues related to this technology. Later parts of the chapter focus on the LTCC process flow in detail. Finally, we list the major LTCC material suppliers and worldwide service foundries as a quick reference guide for readers.

show abstract

Section: (1) 5g Aipmentioning

confidence: 99%

Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms

Shamim

Zhang

2020

Antenna‐in‐Package Technology and Applications

View full text Add to dashboard Cite

show abstract

“…Miniaturization enables future 5G modules to be integrated in many "things" and products around us, and thus enable the vision of connectivity anywhere, anytime from anyone and anything. Our proposed AiP platform ensures miniaturization by not using an interposer and also by eliminating the multilayered configuration typically used between the chip and the antenna in other AiP platforms (e.g., in [6] and [7]).…”

Section: E) Miniaturization Requirementmentioning

confidence: 99%

“…So far, a variety of outstanding packaging and system-integration platforms with integrated antennas (AiPs) for 5G mmWave have been proposed by academia and industry. These include organic-based multilayered AiP with integrated air cavity [6], ceramicbased multilayered AiP [7], mold-based fan-out wafer level AiP [8] and glass-based AiP [9] platforms. Although each of these AiP platforms meet some of the key requirements for the development of scalable, lowcost, miniaturized and high-performance 5G mmWave systems, none of them meet all the requirements.…”

Section: Introductionmentioning

confidence: 99%

A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems

Ndip

Andersson

Kosmider

et al. 2020

2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

View full text Add to dashboard Cite

In this work, we present a novel packaging and system-integration platform with integrated antennas (antenna-in-package, AiP, platform) for 5G millimeterwave (mmWave) systems. We illustrate the application of the platform for the development of miniaturized, scalable, low-cost and high-performance 5G mmWave systems for new radio (NR) base stations. RF characterization of the dielectric material of the platform and the integrated mmWave antennas as well as thermal investigations of the platform are presented. The process steps required for the fabrication of the platform are discussed, and an example of a mmWave chip embedded in the platform is shown.

show abstract

“…Greater interest in developing antenna designs for fifth generation technology has been shown by antenna researchers specifically at the 37–40 GHz frequency band [ 28 , 29 , 30 , 31 , 32 , 33 ]. Atmospheric losses for this frequency band are effectively minimum [ 34 ], which will be helpful for the future mm-wave based 5G communication to achieve its target of higher bandwidth provision and data rates more effectively.…”

Section: Introductionmentioning

confidence: 99%

“…Furthermore, the size of the reported antenna array is 130 mm × 65 mm, which is quite large. Moreover, the antenna covering the 37–39 GHz band adopts an array structure for mm-wave applications to improve the gain [ 31 ]. The maximum gain achieved is 8.81 dB, while the antenna element reported in [ 32 ] adopts few metasurfaces to improve the gain but still the antenna element gain is not enhanced up to 12 dB and MIMO features are also lacking.…”

Section: Introductionmentioning

confidence: 99%

Design of a Millimeter-Wave MIMO Antenna Array for 5G Communication Terminals

Khan¹,

Ullah²,

Ali³

et al. 2022

Sensors

View full text Add to dashboard Cite

This paper presents a design of multiple input multiple output (MIMO) antenna array for 5G millimeter-wave (mm-wave) communication systems. The proposed MIMO configuration consists of a two antenna arrays combination. Each antenna array consists of four elements which are arranged in an even manner, while two arrays are then assembled with a 90-degree shift with respect to each other. The substrate used is a 0.254 mm thick Rogers RT5880 with a dielectric constant of 2.2 and loss tangent of 0.0009, correspondingly. The proposed MIMO antenna array covers the 37 GHz frequency band, dedicated for 5G millimeter-wave communication applications. The proposed antenna element yields a gain of 6.84 dB, which is enhanced up to 12.8 dB by adopting a four elements array configuration. The proposed MIMO antenna array performance metrics, such as envelope correlation coefficient (ECC) and diversity gain (DG), are observed, which are found to be under the standard threshold. More than 85% of the radiation efficiency of the proposed MIMO antenna array is observed to be within the desired operating frequency band. All the proposed designs are simulated in computer simulation technology (CST) software. Furthermore, the measurements are carried out for the proposed MIMO antenna array, where a good agreement with simulated results is observed. Thus, the proposed design can be a potential candidate for 5G millimeter-wave communication systems.

show abstract

37–39 GHz Vertically-Polarized End-fire 5G Antenna Array featuring Electrically Small Profile

Cited by 14 publications

References 4 publications

Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms

Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms

A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems

Design of a Millimeter-Wave MIMO Antenna Array for 5G Communication Terminals

Contact Info

Product

Resources

About