3D-FE electro-thermo-magnetic modeling of automotive power electronic modules - Wire-bonding and Copper clip technologies comparison

Abstract

In this work, we propose an electromagnetic and thermal 3D-Finit-Element Modeling and simulation methodology, under COMSOL Multiphysics, applied to a phase-leg high current power modules for automotive EV HEV applications, whose technical specifications are similar but with two different interconnection types [1] [2]. This article compares them in terms of stray electrical resistances and inductances but also in terms of thermal resistances and impedances. It will be shown in this article that the introduction of a copper clips only slightly modify the thermal extraction while the electrical performance will be greatly improved.