3D system-in-package design using stacked silicon submount technology

Abstract

Purpose -This study aims to provide a flexible and cost-effective solution of 3D heterogeneous integration for applications such as micro-electro-mechanical system (MEMS) applications and smart sensor systems. Design/methodology/approach -A novel 3D system-in-package (SiP) based on stacked silicon submount technology was successfully developed and well-demonstrated by the fabrication and assembly process of a selected smart lighting module. Findings -The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The bonding and interconnecting process is quite simple and does not require complicated equipment. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. The submount wafer can be assembled and tested at the wafer level, thus reducing the cost and improving the yield.Research limitations/implications -The embedding design presented in this paper is applicable for modules with limited number of passives. When it comes to cases with more passive devices, new process needs to be developed to achieve fast, inexpensive and reliable assembly. Originality/value -The presented 3D SiP design is novel for applications such as smart lighting, Internet of Things, MEMS systems, etc.

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

“…There are many interconnection technologies such as wire bonding, edge connects, and capacitive or inductive coupling methods that could be used to fabricate 3D-IC devices [2,3]. However, the most promising technology for fabricating 3D-IC packages is the through-silicon-via (TSV) technology, where the TSVs are used for power delivery and signal exchange between the stacked chips [4,5]. TSV technologies have already been shown successful in reducing signal delay, enhancing IC integration and decreasing the overall packaging volume [6].…”

System in package (SiP) technology: fundamentals, design and applications

“…The presented silicon submount approach should provide satisfying reliability by easing the thermal management. More detailed results were discussed in the previous work (Dong et al , 2013, 2015).…”

“…By using the 3S technology, highly compact modules with system function are aimed to be achieved at reasonable cost. A smart lighting system (Dong et al , 2013, 2015) and particulate matter (PM) sensor system (Dong et al , 2017, 2016) were chosen as development demo in this paper.…”

Low-Dimensional Materials for Disruptive Microwave Antennas Design

“…There are many interconnection technologies such as wire bonding, edge connect and capacitive or inductive coupling method to fabricate 3D-IC devices [23,24]. However, the most key technology for enabling 3D-IC package is throughsilicon via (TSV) technology which acts as paths for signal exchange and power delivery between the stacked chips [25,26]. TSV technology has allowed great progress in reducing signal delay, enhancing the IC integration and decreasing the overall packaging volume [27].…”