“…Especially, exploiting the unique ultra fast switching behaviour of SiC diodes will be the pushing key in establishing SiC technology with advanced components as high voltage Si-IGBTs even in high power management. Regardless of considerable improvements in the static IVcharacteristics [1,2], in the turn-off behaviour [3,4] and with respect to V F drifts after stress [2,5,6], the quality of wafers and epitaxial layers, quantified by defect densities, is still limiting the yield of such devices for larger active chip areas required for high current capabilities. Besides these technological challenges there does still exist a lack in device design since physical key parameters as e.g.…”