A 0.8 V 0.23 nW 1.5 ns Full-Swing Pass-Transistor XOR Gate in 130 nm CMOS

Abstract

A power efficient circuit topology is proposed to implement a low-voltage CMOS 2-input pass-transistor XOR gate. This design aims to minimize power dissipation and reduce transistor count while at the same time reducing the propagation delay. The XOR gate utilizes six transistors to achieve a compact circuit design and was fabricated using the 130 nm IBM CMOS process. The performance of the XOR circuit was validated against other XOR gate designs through simulations using the same 130 nm CMOS process. The area of the core circuit is only about 56 sq · µm with 1.5659 ns propagation delay and 0.2312 nW power dissipation at 0.8 V supply voltage. The proposed six-transistor implementation thus compares favorably with other existing XOR gate designs.

Troubleshooting Techniques of Complex Multi-Layered PCBs

“…It is not something which can be studied from books, but has to be acquired through constant troubleshooting and experimenting. Basically, troubleshooting depends on the circuit complexity, on symptoms, and on the personal experience [3]. The most common troubleshooting techniques are listed below:…”

“…This inspection is part of the so-called sensory checks [3]. Sensory checks rely on the human senses to detect a possible fault [3].…”

“…This inspection is part of the so-called sensory checks [3]. Sensory checks rely on the human senses to detect a possible fault [3]. The visual inspection of the PCB is the simplest troubleshooting technique (which is very effective in many of the cases) [3], without energizing the PCB.…”

“…Sensory checks rely on the human senses to detect a possible fault [3]. The visual inspection of the PCB is the simplest troubleshooting technique (which is very effective in many of the cases) [3], without energizing the PCB. But be careful don't touch the PCB without taking ESD (Electrostatic discharge) protection especially if the signs shown in figure are indicate on PCB.…”

“…The PCB has to be inspected visually for blown fuse, burnt components, jumper settings, broken tracks, missing components, loose connections and carbon on ICs sockets and connectors. Sometimes, components that overheat leave a brown mark on the board [3]. They can be used as 'starting points' in the troubleshooting process and the reasons why they overheat have to be determined [3].…”