A 120 GHz Fully Integrated 10 Gb/s Short-Range Star-QAM Wireless Transmitter With On-Chip Bondwire Antenna in 45 nm Low Power CMOS

Deferm, Noël; Reynaert, Patrick

doi:10.1109/jssc.2014.2319250

Cited by 44 publications

(12 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In order to perform measurements using a single BERT and also observe the performance in complex mmW channels, a metal reflector was used to close the Tx-Rx loop when transceivers are placed side by side. Even in the complex/non-ideal extended channel formed by the reflector, >12 Gbps data transmission with <10 -6 BER was measured at nearly 5 m. This link was realized with an energyefficiency better than 1.6 pJ/b/s which is at least 40 times better than state-of-the-art high-speed TRx's [53][54][55][56][57][58][59][60]. This is partially due to the high EIRP/PDC,TX (>130 times compared to [53][54][55][56][57][58]) owing to the high gain yet compact antenna-system as well as the energy efficient OOK system.…”

Section: Active Measurements For 5g Backhaul/fronthaulmentioning

confidence: 99%

Ball Grid Array Module With Integrated Shaped Lens for 5G Backhaul/Fronthaul Communications in F-Band

Bisognin

Nachabe

Luxey

et al. 2017

IEEE Trans. Antennas Propagat.

View full text Add to dashboard Cite

In this paper, we propose a ball grid array (BGA) module with integrated 3D-printed plastic lens and dedicated 120 GHz OOK transceiver for 5G Backhaul/Fronthaul applications. The problem to be addressed is the following: 5G future networks will need backhaul/fronthaul 10Gbps wireless links and it's mandatory to design cost-effective and energy efficient solutions. The proposed solution is made of 3D-printed plastic lens antenna and cheap 7×7×0.362 mm 3 BGA module integrating a 2×2 array of aperture-coupled patch antennas as the source of the lens. The measurement results of the full system confirm the expected performance of the plastic lens: a-10dB matching and a 28 dBi realized gain from 114 to 140 GHz. The active measurements allows a Tx/Rx link >12Gbps data transmission with <10-6 BER at nearly 5m. This link is realized with an energy-efficiency better than 1.6 pJ/b/s which is at least 40 times better than state-ofthe-art high-speed existing TRx's. Those promising results pave the way for future cost-effective and low consumption backhaul/fronthaul systems for 5G communications. What is the novelty of your work over the existing work (100 words)? So far, several wireless links at 120 GHz have been deployed by various authors with very high Gbps speed but at the expense of high DC consumption and bulky material which is in turn correspond to weak integration of the full-system. The novelty of our work lies in the fact that every communicating block has been optimized in conjunction with all the other nearby elements, strongly taking into account cost and integration capability. Therefore a Tx/Rx link >12Gbps data transmission with <10-6 BER at nearly 5m. This link is realized with an energy-efficiency better than 1.6 pJ/b/s which is at least 40 times better than state-of-the-art high-speed existing TRx's. Provide up to three references, published or under review, (journal papers, conference papers, technical reports, etc.) done by the authors/coauthors that are closest to the present work. Upload them as supporting documents if they are under review or not available in the public domain. Enter "N.A." if it is not applicable. [1] A.

show abstract

Section: Active Measurements For 5g Backhaul/fronthaulmentioning

confidence: 99%

Ball Grid Array Module With Integrated Shaped Lens for 5G Backhaul/Fronthaul Communications in F-Band

Bisognin

Nachabe

Luxey

et al. 2017

IEEE Trans. Antennas Propagat.

View full text Add to dashboard Cite

show abstract

“…The drawback of off-chip antennas is related to more complex packaging and the necessity of millimeter-wave chip-to-antenna interconnects, which often determines the overall system performance. Use of bondwires as radiating elements is yet another interesting alternative alleviating some of the latter issues [26].…”

Section: Differential Chip-to-antenna Interconnectsmentioning

confidence: 99%

Design and experimental evaluation of compensated bondwire interconnects above 100 GHz

Valenta

Spreng

Yuan

et al. 2015

Int. J. Microw. Wireless Technol.

View full text Add to dashboard Cite

Different types of bondwire interconnect for differential chip-to-antenna and single-ended chip-to-chip interfaces are investigated. Two differential compensation structures for various lengths of interconnects are designed and experimentally evaluated using dedicated transmit and receive radar modules operating across a 110-156 GHz band. Measurement results demonstrate that a fractional bandwidth of 7.5% and a minimum insertion loss of 0.2 dB can be achieved for differential interconnects as long as 0.8 mm. Design and measurement results of an extremely wideband low-loss single-ended chip-to-chip bondwire interconnect that features 1.5 dB bandwidth from DC to 170 GHz and insertion loss of less than 1 dB at 140 GHz are presented as well. The results show that the well-established wire-bonding techniques are still an attractive solution even beyond 100 GHz. Reproducibility and scalability of the proposed solutions are assessed as well.

show abstract

“…Numerous examples of short-range sensing devices operating in the 122 GHz ISM-band can already be found in literature [7]- [11]. Furthermore, the D-band's high-speed data transfer capability over short ranges as demonstrated in [12] and [13] could fulfill the future requirements of beyond-5G dense communication networks [14]- [16]. Potential applications are not limited to short ranges: a data link across 60 km was demonstrated with an adapted commercial 122 GHz radar transceiver in [17].…”

Section: Introductionmentioning

confidence: 99%

A Review of Design and Integration Technologies for D-Band Antennas

Kok

Smolders

Johannsen

2021

IEEE Open J. Antennas Propag.

View full text Add to dashboard Cite

This article reviews the current state-of-the-art of millimeter-wave (mm-wave) antennas for communication and sensing applications in the D-band between 110 and 170 GHz. The most popular design techniques, including Antenna-on-Board (AoB), slotted waveguides, Antenna-in-Package (AiP) and Antenna-on-Chip (AoC), are described using relevant examples from scientific literature. Potential benefits and limitations of integration technologies, such as specialized packaging, chip post-processing steps and interconnects, are listed as well. The reported performances of all listed designs are compared against each other, taking the antenna size relative to operating frequency into account. This novel comparison indicates that small-scale integrated AiP and AoC designs can achieve competitive performance levels with short and low-loss interconnects.Index Terms-Antenna-in-Package, Antenna-on-Board, Antenna-on-Chip, D-band, millimeter-Wave This document is a result of the NEXTPERCEPTION project (www.nextperception.eu), which is jointly funded by the European Commission and national funding agencies under the ECSEL joint undertaking.

show abstract

A 120 GHz Fully Integrated 10 Gb/s Short-Range Star-QAM Wireless Transmitter With On-Chip Bondwire Antenna in 45 nm Low Power CMOS

Cited by 44 publications

References 17 publications

Ball Grid Array Module With Integrated Shaped Lens for 5G Backhaul/Fronthaul Communications in F-Band

Ball Grid Array Module With Integrated Shaped Lens for 5G Backhaul/Fronthaul Communications in F-Band

Design and experimental evaluation of compensated bondwire interconnects above 100 GHz

A Review of Design and Integration Technologies for D-Band Antennas

Contact Info

Product

Resources

About