A 60 GHz phased array with measurement and de-embedding techniques

DeLong, Brock J.; Govindarajulu, Sandhiya Reddy; Novak, Markus H.; Alwan, Elias A.; Volakis, John L.

doi:10.1007/s10470-018-1295-1

Cited by 4 publications

(3 citation statements)

References 13 publications

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“…The 3 dB bandwidth metric used here is comparable to a VSWR < 1.4, while the state-of-the-art bandwidths reported for traditional electronic arrays are against VSWRs of <2 and commonly <3 that are equivalent to power variations of 6 and 9.5 dB, respectively. Considering a 6 dB variation, the proposed array approaches 6:1 bandwidth at broadside and maintains 4.5:1 bandwidth out to 30 • scan angles in both planes; to the best of our knowledge, these are the highest broadside and scanning bandwidths reported for an antenna array operating at these frequencies [23], [49]- [51].…”

Section: Simulated Antenna Resultsmentioning

confidence: 71%

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Millimeter Wave Photonic Tightly Coupled Array

Carey

Konkol

Shi

et al. 2021

IEEE Trans. Antennas Propagat.

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We present a tightly coupled array antenna excited by high-power photodiodes for millimeter wave transmit operation. The design includes thinned photodiode substrates for improved bandwidth performance at high frequency combined with the inherently lightweight, low-loss, and direct feeding architecture afforded by the photonic approach. Circuit and full wave simulations are conducted for array design and compared against the traditional electronic arrays in the literature. A prototype 1 × 3 photonic array is developed and characterized to validate the design which achieves a 3 dB (VSWR < 1.4) radiated power bandwidth of 4.6:1 across 13-60 GHz and maintains a 3 dB bandwidth near 4:1 across scan angles up to 30 • . The fabricated array exhibits a 3 dB radiated power bandwidth of 1.8:1 across 30-55 GHz and a maximum measured effective isotropic radiated power of 19.4 dBm at 40 GHz.Index Terms-High-power photodiode, optically fed phased array, RF photonics, tightly coupled array (TCA) antenna, ultrawideband (UWB). I. INTRODUCTIONP HASED array antennas are essential in the development of advanced multifunctional RF systems that serve both commercial and defense sectors. Emphasis in the defense community is placed on the consolidation of RF front ends, signal processing algorithms, and control centers with adaptive subsystems effective for radar and communication [1], [2]. Consolidation of RF front ends with adaptive, multifunctional capabilities requires phased arrays with multioctave operational bandwidths, high transmit power and beam space diversity, frequency agility, scaling potential, and optimal size, weight, and power (SWaP). Similar requirements are of interest in the commercial sector where these benefits can be leveraged in the fifth-generation (5G) cellular communications and mobile networks [3]. Generally, 5G encapsulates the modern trend to continually increase wireless data capacity. Specifically, increasing data capacity ultimately requires increased Manuscript

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Section: Simulated Antenna Resultsmentioning

confidence: 71%

“…The array exhibits a maximum EIRP of 19.4 dBm at 40 GHz and a 3 dB (VSWR < 1.4) radiated power bandwidth of 1.8:1 across 30-55 GHz. To the best of our knowledge, this is the highest reported bandwidth for a fabricated phased array operating at these frequencies [23], [49]- [51].…”

Section: Discussionmentioning

confidence: 78%

Millimeter Wave Photonic Tightly Coupled Array

Carey

Konkol

Shi

et al. 2021

IEEE Trans. Antennas Propagat.

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“…Notably, the most widely implemented mm-wave antennas are either a dipole, a patch, a grid or a loop antenna. These antennas are simple to design and are of small size, which make them ideal candidates for system-on-chip (SoC)/system-in-package (SiP) integration [6][7][8].…”

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confidence: 99%

A 60 GHz Millimeter-Wave Antenna Array for 3D Antenna-in-Package Applications

Govindarajulu¹,

Hokayem

Alwan

2021

IEEE Access

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This paper presents a 60 GHz millimeter-wave (mm-wave) antenna array using standard printed circuit board (PCB) for 3D Antenna-in-package (AiP) implementation. The array consists of a 4 microstrip patch elements, differentially fed with an open stub matching feed network to enable 3D integration. The 1×4 finite antenna array with ball grid array (BGA) and silicon (Si) interposer operates from 58.46 to 62.14 GHz with 3.6 GHz instantaneous bandwidth, low mutual coupling of about <-25 dB and achieves a realized gain of about 10.51 dBi. The array is capable of scanning down to ±45 0 and provides low cross polarization levels of -40 dB. The fabricated multilayer 1×4 array consists of two substrates and one bondply layer with antennas, via-to-open stub matching network, and a differential to single-ended corporate feed network for the measurement. A prototype with a differential to single-ended corporate feed network was fabricated and tested showing a gain of about 10.02 dBi at the operating frequency with ≥90% radiation efficiency. Such a gain and efficiency make the presented design a leading candidate for 3D AiP applications.

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