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Wireless technology is growing at a fast rate to accommodate the expanding user demands. Currently, the radio frequency (RF) spectrum is overcrowded. Hence, it is more susceptible to signal fratricide and interference. To enhance spectrum access, in-band full duplex systems are implemented to achieve simultaneous transmission and reception (STAR) and double the spectral efficiency. However, STAR systems require suppression of the high power transmit signals that can leak into the receiver chain. This type of self-interference (SI) can significantly reduce the receiver.s dynamic range and often leads to its desensitization. Therefore, successful STAR implementation requires considerable isolation between the transmitter and receiver to reduce the SI signal. To do so, RF self-interference cancellation (RFSIC) stages are considered. In this paper, we present a two-stage SIC system that includes transmit and receive antennas isolation and RFSIC filter stages. Notably, the isolation between the transmit and receive antennas is based on a novel symmetric suppression technique. The RFSIC filter is based on a hybrid finite impulse response (FIR) filter and resonator architecture. Adding a resonator to the FIR filter provides improved matching to approximate and suppress the direct SI coupling. Our design achieves ∼52 dB isolation on average across a 500 MHz bandwidth (viz. 1-1.5 GHz) in simulation. Simulation results show a minimum cancellation of 41 dB and a maximum cancellation of 65 dB. A prototype was fabricated and tested, showing an average of ∼ 44 dB cancellation which is in good agreement with our simulation.INDEX TERMS Coupling signal, in-band full duplex (IBFD), STAR, self-interference cancellation (SIC).

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This paper presents a 60 GHz millimeter-wave (mm-wave) antenna array using standard printed circuit board (PCB) for 3D Antenna-in-package (AiP) implementation. The array consists of a 4 microstrip patch elements, differentially fed with an open stub matching feed network to enable 3D integration. The 1×4 finite antenna array with ball grid array (BGA) and silicon (Si) interposer operates from 58.46 to 62.14 GHz with 3.6 GHz instantaneous bandwidth, low mutual coupling of about <-25 dB and achieves a realized gain of about 10.51 dBi. The array is capable of scanning down to ±45 0 and provides low cross polarization levels of -40 dB. The fabricated multilayer 1×4 array consists of two substrates and one bondply layer with antennas, via-to-open stub matching network, and a differential to single-ended corporate feed network for the measurement. A prototype with a differential to single-ended corporate feed network was fabricated and tested showing a gain of about 10.02 dBi at the operating frequency with ≥90% radiation efficiency. Such a gain and efficiency make the presented design a leading candidate for 3D AiP applications.