2011
DOI: 10.1016/j.cap.2011.07.002
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A brief review of dual-frequency capacitively coupled discharges

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Cited by 42 publications
(24 citation statements)
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“…microelectronics, semiconductors, material engineering, etc., where low-pressure discharge plasmas have been utilized for a long time with practical levels of industry. For example, in the microelectronics engineering, dry etching processes have been widely applied for more than 30 years for the commercial fabrication of memories [7], where typically, fluorine radicals are generated from fluorocarbon gases in the argon-based low-temperature plasmas like CCP [8,9], ICP [10,11], ECR plasmas [12,13], or others, and applied to material etching out of the substrate. On the other hand, for thin-film deposition processes like photovoltaic-device manufacturing, silicon-based materials are quite often deposited on substrates from the SiH 4 or other siliconcompound gaseous molecules [14,15].…”
Section: Introductionmentioning
confidence: 99%
“…microelectronics, semiconductors, material engineering, etc., where low-pressure discharge plasmas have been utilized for a long time with practical levels of industry. For example, in the microelectronics engineering, dry etching processes have been widely applied for more than 30 years for the commercial fabrication of memories [7], where typically, fluorine radicals are generated from fluorocarbon gases in the argon-based low-temperature plasmas like CCP [8,9], ICP [10,11], ECR plasmas [12,13], or others, and applied to material etching out of the substrate. On the other hand, for thin-film deposition processes like photovoltaic-device manufacturing, silicon-based materials are quite often deposited on substrates from the SiH 4 or other siliconcompound gaseous molecules [14,15].…”
Section: Introductionmentioning
confidence: 99%
“…12 Typically, the dual-frequency concept is being used to allow separate control over the ion energies and the fluxes at the substrate in plasma processing at low pressures. [13][14][15][16][17][18] In contrast, in atmospheric pressure, the dual-frequency concept is being used because it exhibits superior discharge characteristics including better plume length, current density, and electron excitation temperature of the plasma. However, mixing a microwave frequency with a typical frequency such as 13.56 MHZ and its effects on the electron kinetics including the electron energy distribution function (EEDF) and energetic electrons on the electrode have not been clarified.…”
Section: Introductionmentioning
confidence: 95%
“…8,9 Various models and simulations have been proposed to study the 2f CCRF plasma. [10][11][12][13][14][15][16] Several experiments have been also reported. 17,18 Electron heating mechanism is the key issue in understanding the CCRF plasma discharges.…”
Section: Introductionmentioning
confidence: 95%