“…microelectronics, semiconductors, material engineering, etc., where low-pressure discharge plasmas have been utilized for a long time with practical levels of industry. For example, in the microelectronics engineering, dry etching processes have been widely applied for more than 30 years for the commercial fabrication of memories [7], where typically, fluorine radicals are generated from fluorocarbon gases in the argon-based low-temperature plasmas like CCP [8,9], ICP [10,11], ECR plasmas [12,13], or others, and applied to material etching out of the substrate. On the other hand, for thin-film deposition processes like photovoltaic-device manufacturing, silicon-based materials are quite often deposited on substrates from the SiH 4 or other siliconcompound gaseous molecules [14,15].…”