A characterization of Kapton polyimide by X-ray photoelectron spectroscopy and energy dispersive spectroscopy

Wang, Pu Sen; Wittberg, T. N.; Wolf, J. Douglas

doi:10.1007/bf01106825

Cited by 26 publications

(18 citation statements)

References 6 publications

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“…1a). These particles were the slip additive to Kapton HN1418. It has been shown that the majority of the slip additive particles exuded to the surface of the substrate19, which is consistent with our observation (Fig.…”

Section: Resultssupporting

confidence: 92%

A bio-enabled maximally mild layer-by-layer Kapton surface modification approach for the fabrication of all-inkjet-printed flexible electronic devices

Fang

Hester

et al. 2016

Sci Rep

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A bio-enabled, environmentally-friendly, and maximally mild layer-by-layer approach has been developed to surface modify inherently hydrophobic Kapton HN substrates to allow for great printability of both water- and organic solvent-based inks thus facilitating the full-inkjet-printing of flexible electronic devices. Different from the traditional Kapton surface modification approaches which are structure-compromising and use harsh conditions to target, and oxidize and/or remove part of, the surface polyimide of Kapton, the present Kapton surface modification approach targeted the surface electric charges borne by its additive particles, and was not only the first to utilize environmentally-friendly clinical biomolecules to build up a thin film of protamine-heparin complex on Kapton, but also the first to be conducted under minimally destructive and maximally mild conditions. Besides, for electrically charged ink particles, the present surface modification method can enhance the uniformity of the inkjet-printed films by reducing the “coffee ring effect”. As a proof-of-concept demonstration, reduced graphene oxide-based gas sensors, which were flexible, ultra-lightweight, and miniature-sized, were fully-inkjet-printed on surface modified Kapton HN films and tested for their sensitivity to dimethyl methylphosphonate (a nerve agent simulant). Such fabricated sensors survived a Scotch-tape peel test and were found insensitive to repeated bending to a small 0.5 cm radius.

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Section: Resultssupporting

confidence: 92%

A bio-enabled maximally mild layer-by-layer Kapton surface modification approach for the fabrication of all-inkjet-printed flexible electronic devices

Fang

Hester

et al. 2016

Sci Rep

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“…These two types of Kapton possess the same (PMDA–ODA) chemistry and are often regarded as having the same physical and chemical properties. A difference between them, however, is that Kapton HN contains a slip additive based on dicalcium phosphate while Kapton H does not 18. Particles of this slip additive are embedded into the film.…”

Section: Introductionmentioning

confidence: 99%

Surface modification studies of Kapton^® HN polyimide films

Huang

Bhangale

Moran

et al. 2003

Polymer International

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Surface imide hydrolysis of Kapton HN polyimide films in a 1 M KOH aqueous solution was studied using dynamic contact angle measurements, X‐ray photoelectron spectroscopy (XPS) and time‐of‐flight secondary ion mass spectrometry (TOF‐SIMS). The surface energy of Kapton HN increased quickly upon KOH treatment due to the formation of polar polyamate. Prolonged treatment led to a jump in surface energy that we ascribe to the onset of etching causing increased surface roughness. Potassium depth profiles of treated Kapton HN samples measured by XPS and TOF‐SIMS demonstrated that during the first 10 minutes of 1 M KOH treatment the modification depth increased rapidly. Thereafter the thickness of the modified layer no longer increased. For Kapton H films, however, the development of etching was much slower and a steady increase in modification depth was observed even after long treatment times. The different behaviours between Kapton HN and Kapton H films in alkali solutions are analysed and discussed. Copyright © 2003 Society of Chemical Industry

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“…The polymer solution is chemically imidized using the appropriate chemicals, followed by a heat treatment to remove solvent and conversion chemicals and to also complete the imidi~ation.~ Kapton HN contains a slip additive, phosphate of calcium, but Kapton H does not. 5 Patterning the dielectric is an important step in microelectronics processing as it can provide increased design and product flexibility. These patterns may be formed by mechanical means or chem-ically using plasmas or wet etchants.…”

Section: Introductionmentioning

confidence: 99%

Etch rate studies of base catalyzed hydrolysis of polyimide film. II

Pawlowski

Coolbaugh

Johnson

et al. 1991

J of Applied Polymer Sci

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SYNOPSISThe influence of a potassium carbonate ( K2C03) additive on the base catalyzed hydrolysis of polyimide ( Kaptont) film in aqueous potassium hydroxide (KOH) was determined experimentally. The etch rate is significantly greater for KOH/K2C03 solutions compared with solutions composed of KOH only. The experimental order of the reaction with respect to the KOH concentration was found to be 1.5. In addition, the rate was found to increase linearly with respect to the KzC03 concentration at a fixed KOH concentration. Visual observations of a thinner gel layer on the surface of the film, combined with increased solubility of the etch by-products in KOH/K2C03 relative to KOH, help to explain the difference in etch rate. It appears the ability of K2C03 to enhance the solubility of the hydrolyzed polyimide (polyamic acid salt) results in faster etch rates. I NTRODUCTIO NPolyimide film is used extensively as a dielectric insulating layer in flex circuitry and microelectronics applications because of its good chemical, mechanical, and electrical properties.'-3 In particular, Kapton polyimide film is the workhorse of the electronics industry. Kapton is prepared via the polycondensation of pyromellitic dianhydride (PMDA) and oxydianiline ( ODA) in N,N-dimethylacetamide ( DMAc) , forming the corresponding polyamic acid.The polymer solution is chemically imidized using the appropriate chemicals, followed by a heat treatment to remove solvent and conversion chemicals and to also complete the imidi~ation.~ Kapton HN contains a slip additive, phosphate of calcium, but Kapton H does not.5Patterning the dielectric is an important step in microelectronics processing as it can provide increased design and product flexibility. These patterns may be formed by mechanical means or chem- ically using plasmas or wet etchants. Polyimide can be etched using aqueous base at elevated temperatures.6-s The effect of alcohol type and concentration on etch rate, when alcohol/water/KOH solutions are used to etch Kapton, have been described by Kreuz and hawk in^.^^'^ An increase in the etch rate was found for solutions containing about 80 wt % alcohol and 20 wt % water compared with pure water systems at similar KOH concentrations. Although isopropanol and n -propano1 were found to increase the etch rates above that of ethanol at 0.1 M KOH, the ability of ethanol/water mixtures to dissolve higher KOH concentrations (e.g., 1.OM) results in higher overall etch rates. One proposed explanation was plasticization of the Kapton by the alcohol, allowing faster penetration of the hydroxide anion into the Subsequent work by Stern l1 showed that the rate of alcohol permeation through Kapton is orders of magnitude lower than that of water, indicating the concentration of alcohol in the Kapton would be too low to plasticize the film. Another postulation is that the attacking hydroxide anion is less solvated at high alcohol concentrations and thus reacts with the polyimide more readily.gv10The kinetics of the base catalyzed hydrolysis of Kapton H over a ra...

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A characterization of Kapton polyimide by X-ray photoelectron spectroscopy and energy dispersive spectroscopy

Cited by 26 publications

References 6 publications

A bio-enabled maximally mild layer-by-layer Kapton surface modification approach for the fabrication of all-inkjet-printed flexible electronic devices

A bio-enabled maximally mild layer-by-layer Kapton surface modification approach for the fabrication of all-inkjet-printed flexible electronic devices

Surface modification studies of Kapton^® HN polyimide films

Etch rate studies of base catalyzed hydrolysis of polyimide film. II

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A characterization of Kapton polyimide by X-ray photoelectron spectroscopy and energy dispersive spectroscopy

Cited by 26 publications

References 6 publications

A bio-enabled maximally mild layer-by-layer Kapton surface modification approach for the fabrication of all-inkjet-printed flexible electronic devices

A bio-enabled maximally mild layer-by-layer Kapton surface modification approach for the fabrication of all-inkjet-printed flexible electronic devices

Surface modification studies of Kapton® HN polyimide films

Etch rate studies of base catalyzed hydrolysis of polyimide film. II

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Surface modification studies of Kapton^® HN polyimide films