“…C(x,t)~(x,~=o= (4nD)1/2 Any discussion of this paper will appear in a Discussion Section to be published in the June 1974 JOURNAL. vice and circuit fabrication (1)(2)(3)(4). An important advantage of this method is that the implanted impurities may be thermally redistributed without concurrent oxidation if the implantation is carried out through an existing oxide layer of sufficient thickness (1,5).…”