ESSCIRC 2018 - IEEE 44th European Solid State Circuits Conference (ESSCIRC) 2018
DOI: 10.1109/esscirc.2018.8494312
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A Cortex-M3 Based MCU Featuring AVS with 34nW Static Power, 15.3pJ/inst. Active Energy, and 16% Power Variation Across Process and Temperature

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Cited by 18 publications
(6 citation statements)
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“…In 2018, In Ref. [34], an online monitoring method for Cortex-M3 microprocessors was put forward, which combined critical path replication and in-situ monitoring to deal with the effects of on-chip and inter-chip deviations.…”
Section: Research Status Of Indirect Monitoring Avfs Technologymentioning
confidence: 99%
“…In 2018, In Ref. [34], an online monitoring method for Cortex-M3 microprocessors was put forward, which combined critical path replication and in-situ monitoring to deal with the effects of on-chip and inter-chip deviations.…”
Section: Research Status Of Indirect Monitoring Avfs Technologymentioning
confidence: 99%
“…Depending on whether the shadow element takes a sample before or after the clock-edge, the flagged error is either a predicted or real error respectively. Additionally, both samples can be taken simultaneously when a delay is added before the shadow element [5] resulting in another form of error prediction. To reduce the area impact of the detection, several works [13]- [16] integrate the shadow element into the sequential element as a transition detector (TD) that is activated during the DW.…”
Section: A Error Detectionmentioning
confidence: 99%
“…In (1), the system predicts timing errors rather than detecting them by monitoring for data transitions before the clock-edge. If this prediction is conservative enough, it simply acts as a warning signal that indicates that the system is close to its critical limit [5]. This completely removes the need for a correction method but introduces new margins.…”
Section: Error Correctionmentioning
confidence: 99%
“…To control the temperature of chips, embedded systems usually use dynamic thermal management (DTM) techniques. These techniques usually try to adjust the processor voltage and frequency to control power consumption and temperature [3]- [5]. Many thermal management techniques have been proposed for modern chips due to increased power densities and reliability implications.…”
Section: Introductionmentioning
confidence: 99%