2011
DOI: 10.1149/1.3568952
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A DLTS Study of SiO2 and SiO2/SiNx Surface Passivation of Silicon

Abstract: Deep Level Transient Spectroscopy (DLTS) has been applied to Metal-Oxide-Semiconductor (MOS) capacitors fabricated on crystalline silicon n-and p-type substrates, with a SiO 2 or a SiO 2 /SiN x passivation stack, covered by an Al gate. It is shown that similar interface state distributions are obtained in both cases, from which it is concluded that the SiN x deposition does not degrade the interface. It is also shown that a rather large density of dangling bond defects is present at the Si/SiO 2 interface, whi… Show more

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Cited by 24 publications
(28 citation statements)
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“…As the samples have not been passivated by a FGA, the most likely candidates for the observed electron trap(s) are the silicon dangling bond acceptors (P b 0/− ) in the upper half of the bandgap. 38,39,[45][46][47][48][49] Oxide traps in the lower quality 50 nm deposited SiO 2 correspond with rather large tunneling times, if they are deeper than 5 nm from the interface, practically excluding this explanation.…”
Section: Resultsmentioning
confidence: 99%
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“…As the samples have not been passivated by a FGA, the most likely candidates for the observed electron trap(s) are the silicon dangling bond acceptors (P b 0/− ) in the upper half of the bandgap. 38,39,[45][46][47][48][49] Oxide traps in the lower quality 50 nm deposited SiO 2 correspond with rather large tunneling times, if they are deeper than 5 nm from the interface, practically excluding this explanation.…”
Section: Resultsmentioning
confidence: 99%
“…[37][38][39] For a bias pulse in depletion, mainly deep levels in the silicon depletion region, with a possible contribution from interface states, are probed. Pulsing to V FB or beyond (more positive bias) emphasizes the contribution of the interface states in the upper half of the bandgap and possibly also populates so-called border traps in the SiO 2 .…”
Section: Methodsmentioning
confidence: 99%
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“…The double stack antireflection coating is also stable against external stress, which is beneficial for the fabrication of solar module. [42] Bi-layer schemes with different dielectric materials, like SiO 2 capped with SiN x , have also been explored [43].…”
Section: Wafer Surface Passivation: Dielectric Materialsmentioning
confidence: 99%
“…Among the many techniques for surface passivation on Si, thermal oxidation of Si provides arguably the best-quality passivation [1][2][3]. Si nitride (SiN x ) by plasma-enhanced chemical vapor deposition is widely used in Si photovoltaic solar cells for both surface passivation and antireflection [4,5].…”
Section: Introductionmentioning
confidence: 99%