A dry film technology for the manufacturing of 3-D multi-layered microstructures and buried channels for lab-on-chip

Mulloni, Viviana; Capuano, Andrea; Adami, Andrea; Quaranta, A.; Lorenzelli, Leandro

doi:10.1007/s00542-018-4177-7

Cited by 7 publications

(9 citation statements)

References 44 publications

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“…To avoid sagging of the lid layer of the microfluidic channels, the pressure and the lamination temperature of the second and third DFR layers were reduced. As already noted by several authors [8,9,25] and conformed here, the process parameters of DFR multi-level lamination need only to be adjusted for the second level, whereas, for all further levels, the process parameters of the second level can be used. It has to be noted that a few micro-cavities were formed between the laminated DFR layers, but no influence on the passivation of wirings was noticed.…”

Section: Discussionmentioning

confidence: 77%

“…However, an aspect ratio of only 2.7:1 was reported [6,7]. Vulto et al combined four-layer Ordyl DRF lamination for the fabrication of microfluidic channels with microelectrodes electroplated at the bottom substrate [5], whereas Mulloni et al fabricated a microfluidic device with three-level DFR and electrodes at the top and bottom plate [8]. Trantidou et al [9] as well as Guijt et al [10] developed a multilayer lamination process for simple microfluidic channels.…”

Section: Introductionmentioning

confidence: 99%

“…With regard to the carrying out of the lamination process, the presented literature survey reveals that the first DFR layer is typically laminated onto the substrate at higher pressures and temperatures than the following ones [8,9,25]. For the second and the following layers, the lamination parameters do not change.…”

Section: Introductionmentioning

confidence: 99%

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Dry Film Resist Laminated Microfluidic System for Electrical Impedance Measurements

et al. 2021

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In micro-electrical-mechanical systems (MEMS), thick structures with high aspect ratios are often required. Dry film photoresist (DFR) in various thicknesses can be easily laminated and patterned using standard UV lithography. Here, we present a three-level DFR lamination process of SUEX for a microfluidic chip with embedded, vertically arranged microelectrodes for electrical impedance measurements. To trap and fix the object under test to the electrodes, an aperture is formed in the center of the ring-shaped electrodes in combination with a microfluidic suction channel underneath. In a proof-of-concept, the setup is characterized by electrical impedance measurements with polystyrene and ZrO2 spheres. The electrical impedance is most sensitive at approximately 2 kHz, and its magnitudes reveal around 200% higher values when a sphere is trapped. The magnitude values depend on the sizes of the spheres. Electrical equivalent circuits are applied to simulate the experimental results with a close match.

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Section: Discussionmentioning

confidence: 77%

Section: Introductionmentioning

confidence: 99%

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Dry Film Resist Laminated Microfluidic System for Electrical Impedance Measurements

et al. 2021

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“…In recent decades, microchannels have attracted tremendous attention due to their wide applications in various fields such as biomedicine [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 ], optics [ 14 , 15 ], and microfluidic [ 16 , 17 , 18 ]. Correspondingly, there are already many approaches to fabricate microchannels, such as a glass cover on silicon [ 19 ], sacrificial layer [ 20 ], wafer bonding [ 21 ], sealing [ 22 ], porous silicon [ 23 ], buried channel technology [ 24 ], electric field-assisted capillarity [ 25 ], 3D printing [ 26 ], and soft lithography [ 27 , 28 , 29 ], etc. Compared with other approaches, soft lithography is widely used for applications ranging from simple microchannel fabrication to the creation of micropatterns onto a surface.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Multiple Parallel Microchannels in a Single Microgroove via the Heating Assisted MIMIC Technique

Zhang

Xing

et al. 2022

Micromachines

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For the first time, multiple parallel microchannels in a single microgroove have been fabricated by the heating-assisted micromolding in capillaries technique (HAMIMIC). Microchannel development, cross-sectional shape, and length were all explored in depth. The factors affecting the cross-sectional shape and length of the double-microchannel were also discussed. Finally, a special-shaped PDMS guiding mold was designed to control the cross-sectional shape and length of multiple parallel microchannels for controlled growth. The HAMIMIC technique provides a low-cost, straightforward, and repeatable way to create multiple parallel microchannels in a single microgroove, and will promote the progress of bifurcated vessels and thrombus vessels preparation technology.

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“…Lamination onto patterned dry film resist is more challenging, however, risking damage to the underlying features and poor layer-to-layer adhesion. Lamination onto patterned layers may be possible if only a small percentage of the underlying resist layer is removed during development, such as when microfluidic devices are directly constructed out of dry film resist [ 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 ]. However, microfluidic molds typically require most of each resist layer to be removed during development.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Multilayer Molds by Dry Film Photoresist

Koucherian

Hui

2022

Micromachines

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Dry film photoresists are widely employed to fabricate high-aspect-ratio microstructures, such as molds for microfluidic devices. Unlike liquid resists, such as SU-8, dry films do not require a cleanroom facility, and it is straightforward to prepare uniform and reproducible films as thick as 500 µm. Multilayer patterning, however, can be problematic with dry film resists even though it is critical for a number of microfluidic devices. Layer-to-layer mask alignment typically requires the first layer to be fully developed, making the pattern visible, before applying and patterning the second layer. While a liquid resist can flow over the topography of previous layers, this is not the case with dry film lamination. We found that post-exposure baking of dry film photoresists can preserve a flat topography while revealing an image of the patterned features that is suitable for alignment to the next layer. We demonstrate the use of this technique with two different types of dry film resist to fabricate master molds for a hydrophoresis size-sorting device and a cell chemotaxis device.

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A dry film technology for the manufacturing of 3-D multi-layered microstructures and buried channels for lab-on-chip

Cited by 7 publications

References 44 publications

Dry Film Resist Laminated Microfluidic System for Electrical Impedance Measurements

Dry Film Resist Laminated Microfluidic System for Electrical Impedance Measurements

Fabrication of Multiple Parallel Microchannels in a Single Microgroove via the Heating Assisted MIMIC Technique

Fabrication of Multilayer Molds by Dry Film Photoresist

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