2010
DOI: 10.1088/0960-1317/20/4/045013
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A fabrication technology for three-dimensional micro total analysis systems

Abstract: This paper presents a new fabrication technique capable of creating three-dimensional (3D) buried microchannels in a silicon substrate. With a single mask and a single etch of the substrate, silicon microstructures are created with control in all three dimensions by utilizing reactive ion etch (RIE) lag. The microstructures are then sealed with plasma enhanced chemical vapor deposition (PECVD) dielectrics. By depositing up to 6.3 μm of PECVD oxide, rectangular openings in the masking layer ranging in size from… Show more

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Cited by 30 publications
(15 citation statements)
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“…Recent reports have shown that it is possible to generate isotropic microstructures comprised of curved surfaces by varying the geometrical patterns of the mask layout and using DRIE. This fabrication approach, which is used to etch silicon to different depths using a single-etch step process, is based on the applicability of RIE lag and its dependence on the geometrical patterns of the mask layout [49,50]. …”
Section: Fabrication Techniquesmentioning
confidence: 99%
“…Recent reports have shown that it is possible to generate isotropic microstructures comprised of curved surfaces by varying the geometrical patterns of the mask layout and using DRIE. This fabrication approach, which is used to etch silicon to different depths using a single-etch step process, is based on the applicability of RIE lag and its dependence on the geometrical patterns of the mask layout [49,50]. …”
Section: Fabrication Techniquesmentioning
confidence: 99%
“…The fabrication process flow from silicon to PDMS and hydrogel starts with etching the desired structures in silicon as explained previously (Fig. 1) . In brief, a photomask parameter related to the geometrical value and etch time is generated based on the desired width and depth of structures as shown in Eqs.…”
Section: Methodsmentioning
confidence: 99%
“…For instance, in blood vessels, cells are interacting inside circular channels, with varying diameter along with multiple branches and joints, with each other and their surrounding ECM environment. In this report, we have extended our previous work in 3‐D tissue micropatterning, working toward much more complex and physiologically relevant surface topographies in 3‐D tissue utilizing a single mask, single etch process using reactive ion etching (RIE) lag.…”
Section: Introductionmentioning
confidence: 95%
“…For this work, oxide deposition was performed in a Trion Orion II PECVD machine and silicon etching was performed in an Alcatel AMS‐100 Deep Reactive Ion Etcher (DRIE). We utilize RIE lag and our previously published models to smoothly and arbitrarily vary the depth of the microfluidic channel in a single‐etch‐step process by changing the geometrical pattern on the mask layout. Different microchannel geometries can be fabricated on a single wafer using this technique, two of which are used in this work.…”
Section: Methodsmentioning
confidence: 99%