A facile assembly of polyimide/graphene core–shell structured nanocomposites with both high electrical and thermal conductivities

Xu, Lubo; Chen, Guofei; Wang, Wei; Li, Lan; Fang, Xingzhong

doi:10.1016/j.compositesa.2016.02.027

Cited by 83 publications

(31 citation statements)

References 80 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…High thermal conductivity imparted by frGO@pMMA added in form of core–shell structure could only be explained by the fact that (1) the pPMMA beads act as a frGO carrier and prevent the agglomeration of frGO sheets in the matrix and ensure particle–particle conductive contact throughout the composite mass and (2) in addition, the amine functional group on the surface of the shell “frGO” of the csh‐filler bead could react with the epoxy matrix and thus reduce the phonon scattering at the interface between the epoxy matrix and the filler bead. The achievement in terms of thermal conductivity by the present approach is in the same range or in some cases, even better as compared to those reported in literature (see Table ).…”

Section: Resultssupporting

confidence: 72%

Poly(methyl methacrylate)‐functionalized reduced graphene oxide‐based core–shell structured beads for thermally conductive epoxy composites

Doan

Islam

et al. 2018

J of Applied Polymer Sci

View full text Add to dashboard Cite

Thermally conductive epoxy nanocomposite with core-shell structured filler beads has been prepared. The core represents plasma-treated poly(methyl methacrylate) bead, and the shell, amine-functionalized reduced graphene oxide (frGO) sheets. The negatively charged core and the positively charged shell form core-shell unified structure through electrostatic attraction and the conductive bridges are formed among neighboring filler particles in the composite mass. The epoxy composite prepared with these core-shell structured filler shows a thermal conductivity of 0.72 W m −1 K −1 for an overall frGO concentration of as low as 0.96 wt %. Pal model has been applied to evaluate the effective thermal conductivity of frGO sheets that have been realized in the epoxy composition. Assuming the maximum possible volume packing fraction of the spherical beads for random jamming to be equal to 0.63, the effective thermal conductivity has been estimated as 280 W m −1 K −1 . Evaluation of the effective thermal conductivity is a step forward to in-depth study of real contribution of the highly conductive fillers in the polymer composites.

show abstract

Section: Resultssupporting

confidence: 72%

Poly(methyl methacrylate)‐functionalized reduced graphene oxide‐based core–shell structured beads for thermally conductive epoxy composites

Doan

Islam

et al. 2018

J of Applied Polymer Sci

View full text Add to dashboard Cite

show abstract

“…Therefore, various highly thermal conductive fillers, including metals or metal oxides (silver nanowires, zinc oxide, aluminium oxide, etc. ), carbonaceous materials (carbon nanotube, graphene, etc. ), and ceramic materials (boron nitride (BN), silicon carbide, etc.)…”

Section: Figurementioning

confidence: 99%

Highly Thermally Conductive Polyimide Composites via Constructing 3D Networks

Ding

Wang

et al. 2019

Macromol. Rapid Commun.

View full text Add to dashboard Cite

Easy and high efficient methods are in great demand to obtain polyimide (PI) composites with high thermal conductivity in the electronic packaging field. In this work, PI/boron nitride (BN) composites with high thermal conductivity are easily fabricated. Tightly connected and well‐arranged BN platelets construct effective 3D thermally conductive networks in the PI matrix upon hot pressing, after BN platelets are coated on the surface of PI granules by the help of a kind of PI adhesive. The thermal conductivity of the PI/BN composites reaches as high as 4.47 W mK–1 at a low BN loading of 20 vol%, showing an enhancement of 2099%, compared to pure PI. Such enhancement of the thermal conductivity is the highest compared with the results in the open literature. Our work is a good example that utilized the sufficient physical connection (aggregates) of thermally conductive fillers to significantly promote the thermal conductivity of polymer composites.

show abstract

“…In general, the responsibility of heat dissipation is appointed to polymer matric composites, known as electronic packaging materials, which possess high TC while being dielectric [26,27,35]. To meet the required features for real-time practicality, highly thermal conductive fillers such as ceramic fillers h-BN, silicon carbide (SiC) [36,37], silicon nitride (Si 3 N 4 ) [38], aluminum nitride (AlN), aluminum oxide (Al 2 O 3 ) [39]), carbon-based fillers (carbon nanotube (CNT) [40], graphene [41], diamond [42], carbon fiber [43]), and metal fillers (silver nanowires [44], copper [45], aluminum [46]) have been extensively used to yield thermally conductive polymer composites. High electrical conductivity of carbon-based materials, metal oxides, and metals as fillers also increases the electrical conductivity of the final composite, leading to delayed signal propagation in electronic devices and restrict their application in electronic industry.…”

Section: Fabrication Of H-bn-reinforced Polymer-based Compositesmentioning

confidence: 99%

Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

et al. 2020

View full text Add to dashboard Cite

Ever-increasing significance of composite materials with high thermal conductivity, low thermal expansion coefficient and high optical bandgap over the last decade, have proved their indispensable roles in a wide range of applications. Hexagonal boron nitride (h-BN), a layered material having a high thermal conductivity along the planes and the band gap of 5.9 eV, has always been a promising candidate to provide superior heat transfer with minimal phonon scattering through the system. Hence, extensive researches have been devoted to improving the thermal conductivity of different matrices by using h-BN fillers. Apart from that, lubrication property of h-BN has also been extensively researched, demonstrating the effectivity of this layered structure in reduction of friction coefficient, increasing wear resistance and cost-effectivity of the process. Herein, an in-depth discussion of thermal and tribological properties of the reinforced composite by h-BN will be provided, focusing on the recent progress and future trends.

show abstract

A facile assembly of polyimide/graphene core–shell structured nanocomposites with both high electrical and thermal conductivities

Cited by 83 publications

References 80 publications

Poly(methyl methacrylate)‐functionalized reduced graphene oxide‐based core–shell structured beads for thermally conductive epoxy composites

Poly(methyl methacrylate)‐functionalized reduced graphene oxide‐based core–shell structured beads for thermally conductive epoxy composites

Highly Thermally Conductive Polyimide Composites via Constructing 3D Networks

Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

Contact Info

Product

Resources

About