A fast, low cost method to check for moisture in epoxy molding compound

Lin, Jianming; Teng, A.; Yuen, Mmf

doi:10.1109/eptc.1998.756030

Cited by 3 publications

(2 citation statements)

References 1 publication

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“…These studies have primarily focused on the evolution/degradation of interfacial failure properties with duration of exposure. For example, Lin, et al [3] reported that adsorption of moisture in epoxy molding compounds can be problematic for plastic packaging manufacturers especially in areas where the weather is humid.…”

Section: Figure 1 -Flip Chip Cbga Assemblymentioning

confidence: 98%

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Effects of moisture exposure on the mechanical behavior of flip chip underfills in microelectronic packaging

Chhanda

Suhling

Lall

2014

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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Reliable, consistent, and comprehensive material property data are needed for microelectronics encapsulants for the purpose of mechanical design, reliability assessment, and process optimization of electronic packages. Since the vast majority of contemporary underfills are epoxy based, they have the propensity to absorb moisture, which can lead to undesirable changes in their mechanical and adhesion behaviors. In this study, the effects of moisture adsorption on the stress-strain behavior of an underfill encapsulant were evaluated experimentally and theoretically.A novel specimen preparation procedure has been used to manufacture 60 x 3 mm uniaxial tension test samples, with a specified thickness of 0.5 mm. The test specimens were dispensed and cured with production equipment using the same conditions as those used in actual flip chip assembly, and no release agent was required to extract them from the mold. The fabricated uniaxial test specimens were then exposed in an adjustable thermal and humidity chamber to combined hygrothermal exposures at 85 C and 85% RH for various durations.After moisture preconditioning, a microscale tension-torsion testing machine was used to evaluate the complete stress-strain behavior of the material at several temperatures (T = 25, 50, 75, 100 and 125 C). The viscoelastic mechanical response of the underfill encapsulant has also been characterized via creep testing for a large range of applied stress levels and temperatures before moisture exposure.From the recorded results, it was found that the moisture exposures strongly affected the mechanical properties of the tested underfill including the initial elastic modulus and ultimate tensile stress. With the obtained mechanical property data, a three-dimensional linear viscoelastic model based on Prony series response functions has been applied to fit the stress-strain and creep data, and excellent correlation had been obtained for samples with and without moisture exposure. The effects of moisture were built into the model using the observed changes in the glass transition temperature within the WLF Shift Function.

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Section: Figure 1 -Flip Chip Cbga Assemblymentioning

confidence: 98%

“…Equations (3,4) can be rewritten as: (8) are referred to as the instantaneous shear and bulk moduli, and…”

Section: Mechanical Test Systemmentioning

confidence: 99%

Effects of moisture exposure on the mechanical behavior of flip chip underfills in microelectronic packaging

Chhanda

Suhling

Lall

2014

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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Technical Understanding of Resin-Coated-Copper (RCC) Lamination Processes for Realization of Reliable Chip Embedding Technologies

Manessis

Yen

Ostmann

et al. 2007

2007 Proceedings 57th Electronic Components and Technology Conference

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The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds

Liaw

Chou

2017

Journal of Electronic Packaging

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Encapsulation molding compounds (EMCs) are commonly used to protect integrated circuit (IC) chips. Their composition always contains fillers of a large amount (about 70%) and will affect the properties of the compounds. Thus, in order to clarify the filler effects, in this study, three types of silica fillers including crystal silica, edgeless silica, and fused silica were studied experimentally to explore their effects on the compounds. The results show that all of the flow spiral length, glass transition temperature (Tg), coefficient of thermal expansion (CTE), and water absorption rate of the encapsulation molding compounds decrease as the filler amount increases, irrespective of the filler type. In contrast, both thermal conductivity and flexural strength of the compounds increase as the filler amount increases, but also irrespective of the filler type. For the three fillers, the edgeless silica filler has the advantage of a large flow spiral length and can be molded better. It also has a larger thermal conductivity, larger flexural strength, and lower water absorption rate. Hence, for low stress industrial applications, the edgeless silica should be adopted as the filler of the encapsulation molding compounds.

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A fast, low cost method to check for moisture in epoxy molding compound

Cited by 3 publications

References 1 publication

Effects of moisture exposure on the mechanical behavior of flip chip underfills in microelectronic packaging

Effects of moisture exposure on the mechanical behavior of flip chip underfills in microelectronic packaging

Technical Understanding of Resin-Coated-Copper (RCC) Lamination Processes for Realization of Reliable Chip Embedding Technologies

The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds

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