A Fully Integrated Galvanically Isolated DC-DC Converter With Data Communication

Ragonese, Egidio; Spina, Nunzio; Castorina, A.; Lombardo, P.; Greco, Nunzio; Parisi, Alessandro; Palmisano, G.

doi:10.1109/tcsi.2017.2742021

Cited by 26 publications

(26 citation statements)

References 10 publications

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“…The well-known class-D oscillator loaded by a transformer, as depicted Fig. 2(a) is generally used in galvanic isolation systems [6], [17]. This topology represents a remarkable solution because it provides high oscillation amplitude (i.e., more than twice the supply voltage) as required in galvanic isolation applications.…”

Section: Oscillator Topology Descriptionmentioning

confidence: 99%

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Capacitive-Coupled Stacked Class-D Oscillators for Galvanic Isolators

Spataro

Ragonese

2023

IEEE Trans. Circuits Syst. II

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This brief presents a novel class-D oscillator topology conceived for galvanically isolated data transfer based on RF planar coupling. In its general implementation, it consists of n capacitively coupled stacked class-D oscillators, each one loaded by a primary transformer winding. Capacitive coupling between the oscillators guarantees robust frequency/phase synchronization. The oscillation voltages are combined at the secondary transformer winding, thus ideally producing the same oscillation amplitude of a class-D topology with a power consumption reduced by a factor of 1/n thanks to the current-reuse configuration. With respect to traditional topologies, capacitive-coupled stacked class-D oscillators also allow standard MOS transistors (i.e., with a low breakdown voltage) to be reliably operated at higher supply voltages. The oscillator advantages have been highlighted in comparison with the traditionally adopted complementary cross-coupled topology within an isolated data link based on RF planar coupling in a 0.18-µm CMOS technology.

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Section: Oscillator Topology Descriptionmentioning

confidence: 99%

“…Traditional isolation devices, i.e., optocouplers and discrete transformers, have been widely replaced by highly integrated isolators exploiting electric and magnetic coupling [3], [4], [5], [6], [7]. In the magnetic coupling approach, we can include not only the standard chip-scale isolators (i.e., by means of Fig.…”

Section: Introductionmentioning

confidence: 99%

Capacitive-Coupled Stacked Class-D Oscillators for Galvanic Isolators

Spataro

Ragonese

2023

IEEE Trans. Circuits Syst. II

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“…Moreover, the higher switching frequencies allowed by wideband power devices, such as gallium nitride high-electron-mobility transistors (GaN HEMT) and silicon carbide (SiC) MOSFETs, will require a CMTI beyond 200 kV/µs [2,3]. Traditional chip-scale isolators are based on capacitors [4,5], transformers [6][7][8][9][10][11][12][13][14], and LC hybrid networks [15], which exploit either thick silicon dioxide or polyimide layers as an isolation barrier. These approaches reveal inherent limitations in terms of both isolation rating and CMTI due to the maximum manufacturable dielectric thickness and related capacitive parasitics, respectively.…”

Section: Galvanic Isolators Based On Rf Planar Couplingmentioning

confidence: 99%

“…In particular, the RF oscillator design is very challenging due to stringent specifications in terms of the current consumption for a given oscillation voltage and the start-up time. When thick oxide/lateral transistors with high breakdown voltages are available, as in the BCD technologies [6][7][8][9][10], the D-class topology is highly preferred, as shown in Figure 4a. Indeed, the D-class oscillator boosts the oscillation voltage well above two times the supply voltage, V DD , [22] provided that the maximum draingate voltage V DG_MAX is high enough.…”

Section: Chip-scale Isolation Vs Package-scale Isolationmentioning

confidence: 99%

Package-Scale Galvanic Isolators Based on Radio Frequency Coupling: Micro–Antenna Design

2022

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This paper presents the design of on-chip micro-antennas for package-scale galvanic isolators based on RF planar coupling. A step-by-step design procedure is proposed, which aims at the maximization of the weak electromagnetic coupling between the RX and TX antennas integrated on side-by-side co-packaged chips to enable both high isolation rating and common-mode transient immunity thanks to the high dielectric strength and low capacitive parasitics of a molding compound-based galvanic barrier, respectively. Micro-antenna design guidelines are drawn, highlighting the main relationship between coil coupling performance and their layout parameters, which are often in contrast with respect to traditional integrated inductor ones.

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“…In order to increase both the output power and the isolation rating, isolated DC-DC converters using micro-transformers have been reported [220−228] . Some open-loop converters with an on-chip transformer and an LC tank oscillator operate over 160 MHz while the measured efficiency is less than 30% [220,222] . Soon after, 6-μm-thick gold winding for both the primary and the second coils, with 20-μm polyimide between them to provide >5 kV isolation rating, are implemented in Ref.…”

Section: Efficiency and Power Density Of Isolated Dc-dcmentioning

confidence: 99%

Trending IC design directions in 2022

Chan¹,

Cheng²,

Deng³

et al. 2022

J. Semicond.

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For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially; and the computation power, communication data rate, smart sensing capability and intelligence are always not enough. Hardware supports software, while the integrated circuit (IC) is the core of hardware. In this long review paper, we summarize and discuss recent trending IC design directions and challenges, and try to give the readers big/cool pictures on each selected small/hot topics. We divide the trends into the following six categories, namely, 1) machine learning and artificial intelligence (AI) chips, 2) communication ICs, 3) data converters, 4) power converters, 5) imagers and range sensors, 6) emerging directions. Hope you find this paper useful for your future research and works.

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A Fully Integrated Galvanically Isolated DC-DC Converter With Data Communication

Cited by 26 publications

References 10 publications

Capacitive-Coupled Stacked Class-D Oscillators for Galvanic Isolators

Capacitive-Coupled Stacked Class-D Oscillators for Galvanic Isolators

Package-Scale Galvanic Isolators Based on Radio Frequency Coupling: Micro–Antenna Design

Trending IC design directions in 2022

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