A Global–Local Approach for Mechanical Deformation and Fatigue
                    Durability of Microelectronic Packaging Systems

Zhang, T.; Rahman, Sharif; Choi, Kyung K.; Cho, K.; Baker, P H; Shakil, M.; Heitkamp, Dale H.

doi:10.1115/1.2721092

Cited by 20 publications

(8 citation statements)

References 15 publications

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“…Std [ ] is the standard deviation

\sqrt{\frac{{true \sum}_{i = 1}^{normaln} {((), y_{i} - normalM)}^{2}}{((), normaln - 1)}}

, n is the total nodes, y i is the value of point i , and M is the average value. The optimal value of equivalent solder ball fir parametric vector w can be determined by solving the constrained optimization problem,

\begin{matrix} left \\ \begin{array}{c} center & italiclim \\ center & \underset{w}{true} \end{array} \int ε_{1} (t; \underset{w}{true}) dt \\ Subject to l_{i} (\underset{w}{true}) > 0, i = 1, \dots, n_{c} \end{matrix}

where l i ( w ), i = 1 ,…, n c are linear constraints related to the shape or size of the equivalent model, n c is the total number of constraints. The comprehensive flowchart, which describes the iteration procedure in solving the optimization problems, is shown in Figure .…”

Section: The Global/local Analysis Using Equivalent Solder Ballsmentioning

confidence: 99%

“…A review of various design factors makes it obvious that it would require extensive computing resources to execute simulations, but the aforementioned authors has not yet adopted the concept of equivalent models for simplification and accuracy control. Later, Zhang et al presented a G/L method to predict the deformation and fatigue life of solder balls for the fine pitch BGA and super BGA packages under TCT loading . That analysis included an optimization formulation for modeling an equivalent ball, which was verified by a good agreement between the simulation result and the Moiré experiment.…”

Section: Introductionmentioning

confidence: 98%

See 1 more Smart Citation

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

Cheng

Chen

Mao

2013

Quality & Reliability Eng

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A global/local method with the modified sub-modeling approach of the two-parametric optimal equivalent volume solder balls is introduced to predict the deformation and reliability of the package. The equivalent solder balls as exhibit in this method can obviously reduce the required elements/nodes quantities to enhance computing efficiency. A package model of wire-bonded stacked chip ball grid array under cyclic thermal loading is used as a test vehicle to verify the influences of design factors by fatigue life indicator. Comparing the proposed method with the global fine mesh model, it is found that the difference in the accumulated strain energy density is merely 5.77%, but the optimal equivalent model has highly saved 90% finite element analysis required elements, which means the adopted method can effectively replace the global fine mesh model because both results are in accordance with each other. Using design of experiments to efficiently verify each factor influence with their crosscoupling effects, this paper adopts two kinds of response surface methods that confirm the fatigue life of the proposed approach can be improved by as much as 123.7% for the dual response surface method and 126.3% for the mixed response surface method when comparing with the baseline model. In addition, the optimization of generic algorithm for both response surface methods is demonstrated in this study. From the reviews of factor coupling effects, it is concluded that the response surface method is eligible to achieve the optimum design for package reliability improving.

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“…Std [ ] is the standard deviation

\sqrt{\frac{{true \sum}_{i = 1}^{normaln} {((), y_{i} - normalM)}^{2}}{((), normaln - 1)}}

\begin{matrix} left \\ \begin{array}{c} center & italiclim \\ center & \underset{w}{true} \end{array} \int ε_{1} (t; \underset{w}{true}) dt \\ Subject to l_{i} (\underset{w}{true}) > 0, i = 1, \dots, n_{c} \end{matrix}

Section: The Global/local Analysis Using Equivalent Solder Ballsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 98%

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

Cheng

Chen

Mao

2013

Quality & Reliability Eng

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“…Young modulus for solder joint depends on temperature, see table 9. The viscoplastic behaviour of Sn96.5Ag3.0Cu0.5 solder joint [8] was modelled using Anand parameters [7] as listed in table 10. …”

Section: Chip Modelling: Geometric Detailsmentioning

confidence: 99%

Influence of PCB design and materials on chip solder joint reliability

Berthou

Retailleau

Frémont

et al. 2010

2010 11th International Thermal, Mechanical &Amp; Multi-Physics Simulation, and Experiments in Microelectronics and Microsystem

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This paper describes chip solder joint reliability on three substrate types: one board SMI (aluminium substrate) and two different boards in FR4. Several chip sizes and types (resistor, capacitor) were assembled on these boards. Accelerated Thermal cycles (ATC) -55/+125°C were applied to evaluate the lifetime of chip solder joints. The different results obtained showed an important dispersion in Time To Failure (TTF) according to the substrate type. Literature data confirm this dispersion. To understand this discrepancy Finite Element Modelling (FEM) analyses were used to evaluate the influence of PCB design and materials on solder chip component reliability. The simulations permit to identify which parameters are the most influent.

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“…One of the ways to simplify the 3D model is by coupling models [10,17,18]. The thermal mechanical results are obtained by coupling the general field chip model and the local deformation connection model.…”

Section: Introductionmentioning

confidence: 99%

“…The thermal mechanical results are obtained by coupling the general field chip model and the local deformation connection model. In the general field model, connections are simplified into one-dimensional (1D) beams [18,19]. A rigorous equivalent model library was proposed [18] and an original and general optimization methodology was developed to find the simplified and equivalent model [19].…”

Section: Introductionmentioning

confidence: 99%

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Kohl

2011

Journal of Electronic Packaging

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Finite element modeling (FEM) is an important component in the design of reliable chip-to-substrate connections. However, FEM can quickly become complex as the number of input/output connections increases. Three-dimensional (3D) chip-substrate models are usually simplified where only portions of the chip-substrate structure is considered in order to conserve computer resources and time. Chip symmetry is often used to simplify the models from full-chip structures to quarter or octant models. Recently, an even simpler 3D model, general plane deformation (GPD) slice model, has been used to characterize the properties of the full-chip and local regions on the structures, such as in the structures for solder ball fatigue. In this study, the accuracy of the GPD model is examined by comparing the mechanical behavior of a flip-chip, copper pillar package from various full and partial chip models to that of the GDP model. In addition, it is shown that the GPD model can be further simplified to a half-GPD model by using the symmetry plane in the middle of the slice and choosing the proper boundary conditions. The number of nodes required for each model and the accuracy of the different FEM models are compared. Analysis of the maximum stress in the silicon chip shows that the full-chip model, quarter model, and octant model all convergence to the same result. However, the GPD and half-GPD models, with the previously used boundary conditions, converge to a different stress values from that of the full-chip models. The error in the GPD models for small, 36 I/O package was 4.7% compared to the more complete, full-chip FEM models. The displacement error in the GPD models was more than 50%, compared to the full-chip models, and increased with larger structures. The high displacement error of the GPD models was due to the ordinarily used boundary conditions which neglect the effect from adjacent I/O on the sidewall of the GPD slice. An optimization equation is proposed to account for the spatial variation in the stress on the GPD sidewall. The GPD displacement error was reduced from 50% to 3.3% for the 36 pillar array.

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A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems

Cited by 20 publications

References 15 publications

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

Influence of PCB design and materials on chip solder joint reliability

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

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