This paper presents a novel method for growing a lateral
N+-GaN/n-Si heterojunction with minimum material defects
and
melt-back etching on nanogrooved Si(100) substrates to create devices
with a high breakdown voltage and power amplification efficiency.
The core technique involves the selective-area growth of hexagonal-to-cubic
(h-to-c) GaN on the nano-V-grooved (111) facets of a Si(100) substrate
by using metal–organic chemical vapor deposition. The paper
discusses in detail the proposed process for realizing an n-type metal–oxide–semiconductor
field-effect device with a lateral GaN drain on a cost-effective Si(100)
substrate.