A High-speed Smart Pixel Array using VCSEL based Integrated Optoelectronics

Koiey, B.; Amarnath, K.; Saini, Simarjeet S.; Datta, M.; Wasiczko, Linda M.; Dagenais, M.; Pham, John; Pamulapati, J.; Newman, P. G.; Shen, Paul H.; Chang, W.; Simonis, George J.

doi:10.1364/slm.1999.stub3

Cited by 2 publications

(4 citation statements)

References 3 publications

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“…We have demonstrated that the flip-chip bonded laser driver array is capable of displaying preprogrammed alpha-numeric characters on an infrared detecting screen [12].…”

Section: B Flip-chip Bondingmentioning

confidence: 99%

Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's)

Datta

Merritt²,

Dagenais

1999

IEEE Trans. Comp. Packag. Technol.

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A method for remetallizing the bond pads of electronic chips, which are initially metallized with aluminum or aluminum alloy is presented. Application of electroless plating process for the remetallization of aluminum to a solderable gold surface can reduce the cost and complication of the widely accepted flip-chip interconnection technology. We have developed a step by step nickel/gold wafer bumping technique (remetallized bump height is 5.0 m) for the appropriate solder (15.0 m of In : Pb). Variation of roughness of the remetallized surface has been studied carefully. We have completed prototype research studies on test devices and successfully packaged the flip-chip bonded hybrid pair of a CMOS driver chip and a dummy structure of vertical cavity surface emitting laser (VCSEL) array. Cross section of the flip-chip solder joint is studied. Also, adhesion strength of the metal deposit is investigated. Index Terms-Ball shear test, electroless plating, flip-chip bonding, indium-lead solder, remetallization of aluminum, VCSEL packaging, wire-bonding.

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“…We have demonstrated that the flip-chip bonded laser driver array is capable of displaying preprogrammed alpha-numeric characters on an infrared detecting screen [12].…”

Section: B Flip-chip Bondingmentioning

confidence: 99%

Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's)

Datta

Merritt²,

Dagenais

1999

IEEE Trans. Comp. Packag. Technol.

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“…A detailed analysis of this CMOS driver has been reported separately [10,11]. For high-speed VCSEL-CMOS experiments, addressing circuitry is avoided and each of the 64 channels in the CMOS array are driven independently using a TTL input signal and an independent CMOS drive circuit, as shown in Figure 6 [8]. The VCSEL array was planarized using polyimide.…”

Section: Cmos Driver Circuitsmentioning

confidence: 99%

“…Figure 10 shows the measured performance of one channel of the smart pixel array driven at 1.1 Gb/s. The observed distortion in the eye diagram is limited primarily by packaging constraints [8]. …”

Section: High-speed Vcsel Interconnect Modulation Performancementioning

confidence: 99%

“…Hybrid integration of high-performance photonic devices, such as VCSELs and photodetectors with Si-based electronic circuits using flip-chip bonding, offers a wide range of applications in optical interconnects. Recent advances in VCSELs with dielectric aperture, single-mode operation, low threshold current and voltage, high-efficiency, and high modulation speed [7][8], along with submicron CMOS circuit technologies, make the implementation of optoelectronic interconnects more attractive.…”

Section: Introductionmentioning

confidence: 99%

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1 Gb/s VCSEL/CMOS flip-chip 2-D-array interconnects and associated diffractive optics

Simonis

Pham²,

Koley³

et al.

Proceedings. 6th International Conference on Parallel Interconnects (PI'99) (Formerly Known as MPPOI)

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980-nm substrate-emitting oxidized-aperture verticalcavity surface-emitting lasers (VCSELs) with threshold currents in the 150 µA to 500 µA range have been developed for optoelectronic interconnects. 8 x 8 VCSEL arrays with 125 µm pitch have been flip-chip bonded to CMOS driver circuitry of 0.5-µm gate size. InGaAs/InP 8 x 8 detector arrays have been flip-chip bonded to provide good responsivity and high speed detection in dense arrays with 125-µm pitch. Data rates as high as 1.1 Gb/s have been demonstrated with the incorporation of refractive coupling optics between transmitter and receiver arrays. Studies have been conducted of crosstalk and alignment sensitivity of these optoelectronic interconnect arrays. Design and modeling techniques have been demonstrated for the development of diffractive optics for optoelectronic interconnects. Special techniques have been developed to deal with very short working distances and subwavelength features in the diffractive optics. Fan-out performance up to 7 x 7 with accurately controlled intensity weights has been demonstrated with diffractive optics .The use of diffractive optics in opoelectronic interconnects with fan-out and/or fan-in can make the interconnect an integral part of the optoelectronic processing algorithm.

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A High-speed Smart Pixel Array using VCSEL based Integrated Optoelectronics

Cited by 2 publications

References 3 publications

Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's)

Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's)

1 Gb/s VCSEL/CMOS flip-chip 2-D-array interconnects and associated diffractive optics

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