Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's)

Datta, M.; Merritt, Scott A.; Dagenais, M.

doi:10.1109/6144.774749

Cited by 40 publications

(10 citation statements)

References 8 publications

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“…However, for AgCl in aqueous solution, there is also the solution/deposition equilibrium reaction [7] where K sp refers to the solubility products (9). In cyclic voltammetry with a KCl solution, Cl¯ is consumed during the oxidation half cycle, which disturbs the equilibrium and causes the dissolution of AgCl.…”

Section: Test Of Micro-electrode Sensormentioning

confidence: 99%

Microscale Chloride Sensor

et al. 2006

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Measurements of chloride concentration are important in a range of applications. We report here on our progress toward the fabrication and testing of small, inexpensive chloride sensors integrated with sensing electronics on a CMOS chip. We describe and demonstrate a process for formation of gold and silver chloride/ silver electrodes on a CMOS chip. Cyclic voltammetry is performed on chip-scale electrodes and the test results are discussed.

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Section: Test Of Micro-electrode Sensormentioning

confidence: 99%

Microscale Chloride Sensor

et al. 2006

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“…Electroless nickel/gold metallization is a maskless process and has been widely used in remetallization of aluminium bond pads for flip chip attachment and assembly. For bond pads with aluminium or sputtered aluminium alloy metallization, it has been shown that electroless nickel/gold plating is the most robust remetallization process [8]. To initiate the electroless nickel (EN) deposition, the aluminium bond pads are usually activated with a zinc layer.…”

Section: B Chip Fabrication and Pad Processingmentioning

confidence: 99%

A Low Cost Bumping Method for Flip Chip Assembly and MEMS Integration

Zhang

Wang

Zeng

et al. 2007

IEEE Trans. Comp. Packag. Technol.

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In this paper, we present the development of a low cost chip/wafer bumping technique for flip chip assembly and microelectromechanical systems integration using a bump transfer approach. In this method, high melting temperature bumps such as copper, nickel, and gold bumps are fabricated on a low cost, flexible carrier and then transferred onto the target chip/wafer/board for flip chip assembly. The aluminum pads on test chips were remetallized with electroless nickel and gold layers to facilitate the bonding of bumps to the chips using thermocompression bonding. Parallel bonding and transfer of bumps has been achieved. Thermal cycling and bump shear test showed that reliable bonding was obtained between the bumps and the pads. Surface study using laser ionization mass analysis found no traces of of the polymer carrier on the surface of the bumps on the test chip after the completion of the bump transfer process.Index Terms-Bumping, flexible carrier, flip chip, microelectromechanical systems (MEMS).

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“…Recent developments in the integration of large vertical cavity surface emitting laser ͑VCSEL͒ arrays on complementary metal-oxide semicondutor͑s͒ CMOS͑s͒ increase the potential of parallel optical interconnects. [2][3][4][5] A variety of approaches have been taken to implement such optical interconnects. Unidimensional parallel optical data links, linear VCSEL arrays, and fiber ribbons have demonstrated high performances in recent years.…”

Section: Introductionmentioning

confidence: 99%