A lifetime assessment and prediction method for large area solder joints

Lederer, M.; Kotas, A. Betzwar; Khatibi, Golta

doi:10.1016/j.microrel.2020.113888

Cited by 10 publications

(3 citation statements)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Dias et al [40] tested that the UTS, YS, and elongation (d) of Sn-10Sb solder were 53 MPa, 44 MPa, and 16%, respectively. Compared with Sn-5Sb solder, Sn-10Sb solder has a better UTS and YS, but lower d. Lederer et al [81] conducted mechanical bending fatigue tests on Cu-strip/Sn-Sb-Ag/DCB (commercial direct bonded copper) solder joints. Schematic of fatigue loading is shown in Fig.…”

Section: Sn-sbmentioning

confidence: 99%

See 1 more Smart Citation

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

Wang

Zhang

2021

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Electronic devices need to work at high temperature in some fields for a long time, peculiarly step soldering technology, primary packaging and flip-chip connections, etc., along with the application of electronic products more and more widely. These phenomena promote the further development of hightemperature solders. Because of the high melting temperatures of Sn-Ag and Sn-Sb, they are suitable for high-temperature fields such as automotive electronics and avionics. In this review, the influences of trace elements and nanoparticles on microstructure, intermetallic components (IMC) growth, mechanical properties, wettability, melting behavior, and creep behavior of Sn-Ag and Sn-Sb solders have been summarized systematically. It was found that the addition of trace elements or nanoparticles into solders to be beneficial in improving the performance of Sn-Ag and Sn-Sb solders. Besides, the melting behavior of the solder at high temperatures can be further improved if Sn-Ag and Sn-Sb are used better as high-temperature solders.

show abstract

Section: Sn-sbmentioning

confidence: 99%

“…Fig.22a Schematic of fatigue loading, b Displacement plot of a sample subjected to bending fatigue[81] …”

mentioning

confidence: 99%

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

Wang

Zhang

2021

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

show abstract

“…4) Solders that are suitable for lowtemperature applications are SnBi, 5) SnAg, 6) SnAgCu, 7,8) and SnZn. 9) SnSb 10) and AuSn 11) are suitable for hightemperature applications. With the development of the electronics industry, solders are used in high-temperature environments increasingly but there are relatively little researches about high-temperature solders in numerous references.…”

Section: Introductionmentioning

confidence: 99%

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Wang

Zhang

2022

Mater. Trans.

View full text Add to dashboard Cite

The requirements for electronic devices in high-temperature environment such as avionics and automotive have promoted the development of high-temperature solders. The Au20Sn solder, which is one of the hot topics of the current research in the field of electronic packaging, is widely used in flip-chip, light-emitting diode and hermetic package fields because of its good creep resistance, corrosion resistance and flux-free soldering. Recent research about the microstructure, wettability, interfacial intermetallic compounds, and mechanical properties of Au20Sn solder were reviewed. This paper focuses on the interfacial reaction of Au20Sn with different substrates and the mechanical properties of Au20Sn solder joints. In addition, the current research shortages of Au20Sn solders and the development directions are presented.

show abstract

Tin Multilayer‐Aided SAC305‐Based Lead‐Free Solder Joint Interface with Cu: An Investigation of the Stress Distribution by Finite Element Analysis and Nanoindentation Studies

Char,

Chakraborty,

Bhattacharyya

et al. 2024

Adv Eng Mater

View full text Add to dashboard Cite

Two different types of lead‐free solder joints Cu/(Sn3.0Ag0.5Cu)/Cu and Cu/Sn/(Sn3.0Ag0.5Cu)/Sn/Cu have been investigated. Joints are produced following the transient liquid phase like soldering process. The microstructure of different intermetallic compounds (IMCs) present at the joint interfaces, as well as their indentation hardness and elastic modulus, have been investigated and analyzed using scanning electron microscopy (SEM), X‐ray diffraction (XRD) spectroscopy, and nanoindentation. The exact position of different microcracks inside the interfaces has been identified by analyzing the elastic–plastic properties and interfacial toughness of these solder joints. The modulus and hardness of the Sn multilayer‐assisted solder joint interface are found to be 60.08%, and 90.18% higher than those of its non‐layered counterpart, respectively. The finite element analysis (FEA) has been done to estimate and compute stress distributions over the interfacial region. The dislocation mechanics involved in strengthening the joint strength are related to the nature of stress flow; as observed in FEA. It is reconfirmed that the high susceptibility to brittle failure of the non‐layered Cu‐SAC305 solder joints could be avoided by using a Sn interlayer in between the Cu substrates and the SAC305 solder paste.

show abstract

A lifetime assessment and prediction method for large area solder joints

Cited by 10 publications

References 10 publications

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Tin Multilayer‐Aided SAC305‐Based Lead‐Free Solder Joint Interface with Cu: An Investigation of the Stress Distribution by Finite Element Analysis and Nanoindentation Studies

Contact Info

Product

Resources

About