2004
DOI: 10.1016/j.jcrysgro.2004.02.016
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A model for epitaxial lateral overgrowth of GaAs by liquid-phase electroepitaxy

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Cited by 15 publications
(15 citation statements)
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References 30 publications
(40 reference statements)
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“…To get a deeper insight into the growth mechanism we have developed a mathematical model for lateral overgrowth of semiconductor layers by LPEE [30]. First, the electric field is calculated in the domain as that shown in Fig.…”
Section: Elo Growth By Liquid Phase Electroepitaxymentioning
confidence: 99%
“…To get a deeper insight into the growth mechanism we have developed a mathematical model for lateral overgrowth of semiconductor layers by LPEE [30]. First, the electric field is calculated in the domain as that shown in Fig.…”
Section: Elo Growth By Liquid Phase Electroepitaxymentioning
confidence: 99%
“…However, even such cases, a care must be taken, and the physical phenomena must be examined on physical grounds whether such a simplification can be made. In some crystal processes such as lateral overgrowth of semiconductors, even the growth velocity may be small, the contribution of interface curvature to the growth process may be significant [4][5][6].…”
Section: Discussionmentioning
confidence: 99%
“…In the case of an applied electric current, for instance in electroepitaxy, the contribution of electrotransport to the growth rate will be included (see [6,9]). Similarly, the contributions of surface kinetics and interface curvature can also be included in the species mass balance at the interface [6]. In addition, the interfacial concentrations must also be updated through the satisfaction of the phase diagram equation(s) [9].…”
Section: Discussionmentioning
confidence: 99%
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“…It is also worth mentioning that application of electrically conductive masks gives additional degree of freedom in controlling the shape of ELO layers. In particular, this goal can be achieved if growth is driven by passing an electric current through the mask/substrate interface at constant temperature (liquid phase electroepitaxy -LPEE) instead of cooling of the melt/substrate system, which is a common practice in LPE [3][4][5][6].…”
Section: Introductionmentioning
confidence: 99%