A novel 3D process for single-crystal silicon micro-probe structures

Park, Sangjun; Kim, Bong-Hwan; Kim, Jongpal; Paik, Seung-Joon; Choi, Bok Hee; Jung, Insoo; Chun, Kukjin; Cho, Dong-il $lquot$Dan$rquot$

doi:10.1088/0960-1317/12/5/321

Cited by 37 publications

(27 citation statements)

References 13 publications

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“…MEMS probe cards applying micromachining technologies and electrolytic plating techniques have the advantages of mass production and lower manufacturing costs (Wang et al 2008;Kim and Kim 2008;Marinissen et al 2011). As the MEMS probe card is emerging as the most efficient method in testing at the wafer level, many companies and research institutions are proceeding with its development and production (Park et al 2002;Kim and Kim 2008).…”

Section: Introductionmentioning

confidence: 99%

Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps

Choi

Ryu

2012

Microsyst Technol

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This paper describes the design and fabrication of a guide block and micro probes, which were used for a vertical probe card to test a chip with area-arrayed solder bumps. The size of the fabricated guide block was 10 mm 9 6 mm. The guide block consisted of 172 holes to insert micro probes, 2 guide holes for exact alignment, and 4 holes for bolting between the guide block and the housing of a PCB. Pitch and size of the inserting holes were 80 lm, and 90 lm 9 30 lm, respectively. A silicon on insulator wafer was used as the substrate of the guide block to reduce micro probes insertion error. The micro probes were made of nickel-cobalt (Ni-Co) alloy using an electroplating method. The length and thickness of the micro probes were 910 and 20 lm, respectively. A vertical probe card assembled with the fabricated guide block and micro probes showed good x-y alignment and planarity errors within ±4 and ±3 lm, respectively. In addition, average leakage current and contact resistance were approximately 0.35 nA and 0.378 ohm, respectively. The proposed guide block and micro probes can be applied to a vertical probe card to test a chip with area-arrayed solder bumps.

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Section: Introductionmentioning

confidence: 99%

Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps

Choi

Ryu

2012

Microsyst Technol

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“…Microprobes can be fabricated using several manufacturing processes, which create small silicon and metal mechanical structures (Kim et al 2005;Park et al 2002;Liao and Chen 2005). There are two main approaches for fabricating micro cantilevers and vertical probes.…”

Section: Introductionmentioning

confidence: 99%

New fabrication method for micro-pyramidal vertical probe array for probe cards

et al. 2009

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This paper presents a novel, precision process for fabricating a micro metal vertical probe array with various tip angles. The fabrication process includes an inclined and multiple-exposure in ultraviolet (UV) lithographic and Ni electroforming technology. Because of the light passing through an optical transparent homogenous material, the materials' refractive index results in light path deflection. By changing the photomask and workpiece inclination, controllable various tip angles can be fabricated. The experimental results showed that micro metal vertical probes with 54A degrees, 60A degrees and 68A degrees tip angles are achieved. The micro-pyramidal vertical probe array can be used in vertical-type probe cards without the conventional complicated assembly

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“…High-aspect-ratio micro and nano structures are key components for various microscale devices and systems, such as MEMS and mTAS [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19]. For example, ordered arrays of uniform pores are applicable to micro-channels for micro-fluidic and filtering devices [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

“…Microscale tube and chamber structures are also required for micro reactors [8][9]. Micro and nanoscale needles can be applied to precise injector for cell [10][11][12][13][14], painless injectors [11][12][13][14], and microelectrode for electric measurement of targeted microscopic area [15][16][17], etc. The key processes to fabricate these high-aspect-ratio structures are deep etching to form pores and uniform coating or filling to modify the pores.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of high-aspect-ratio arrayed structures using Si electrochemical etching

Sato

Homma

2006

Science and Technology of Advanced Materials

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This paper reviews microscale processes to fabricate three-dimensional structures, in particular, high-aspect-ratio arrayed structures, using precise electrochemical etching process. Array of sharp micropits were pre-formed on the front side surface of Si wafer and the electrochemical etching was carried out using aqueous HF solution, with the back side illumination to generate holes, which diffused to the edge of the micropits to proceed the dissolution of Si with fluoride species. In order to form high-aspect-ratio pores at selected areas, a shade mask pattern was fabricated on the back side surface to align the illumination to the pre-patterned area on the front side surface. The parameters, such as HF concentration, current density and hole diffusion length, were optimized and uniform array of straight pores was formed into the designed area of Si wafer.Subsequently the surface of the pores was thermally oxidized to form SiO 2 layers, and arrayed glass tubes with picoliter volume were fabricated. On the other hand, the pore filling with metal was attempted using electrodeposition to obtain array of the metal needles. For this, the ''single batch'' process was developed to form the pore array and metal filling with single electrolyte, and array of metal micro needles was successfully formed. These processes demonstrated capability and possibility of the electrochemical processes for microscale fabrication, and further precise processes can be developed using these approaches. r

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A novel 3D process for single-crystal silicon micro-probe structures

Cited by 37 publications

References 13 publications

Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps

Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps

New fabrication method for micro-pyramidal vertical probe array for probe cards

Fabrication of high-aspect-ratio arrayed structures using Si electrochemical etching

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