2009
DOI: 10.1088/0268-1242/24/2/025017
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A novel high breakdown voltage lateral bipolar transistor on SOI with multizone doping and multistep oxide

Abstract: A novel high breakdown voltage lateral bipolar junction transistor (LBJT) on silicon-oninsulator (SOI) is proposed. The novelty of the device is the use of the combination of multistep-doped drift region and multistep buried oxide. The steps in doping and in oxide thickness have been used as a replacement for much complex linearly varying drift doping and linearly varying oxide thickness. The LBJT structure incorporating the combination of multistep doping and multistep oxide is analyzed for electrical charact… Show more

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Cited by 13 publications
(3 citation statements)
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“…However, CMOS fabrication favors lateral bipolar transistor concepts [1][2][3][4][5][6] on SOI since it is easier to tune the SOI layer properties to optimize the CMOS devices without degrading the performance of the bipolar devices [2]. Realization of a true low cost complementary-BiCMOS process is possible only when the lateral bipolar transistors can be fabricated on CMOS using simple fabrication steps with low thermal budgets.…”
Section: Introductionmentioning
confidence: 99%
“…However, CMOS fabrication favors lateral bipolar transistor concepts [1][2][3][4][5][6] on SOI since it is easier to tune the SOI layer properties to optimize the CMOS devices without degrading the performance of the bipolar devices [2]. Realization of a true low cost complementary-BiCMOS process is possible only when the lateral bipolar transistors can be fabricated on CMOS using simple fabrication steps with low thermal budgets.…”
Section: Introductionmentioning
confidence: 99%
“…The lateral BJT on SOI is advantageous in terms of sharing a fabrication scheme with the CMOS and is hence more compatible with it [10,11]. However, the problems with the lateral BJT on SOI are its inferior cutoff frequency (f T ) and current gain (β) due to large base resistance in comparison to vertical BJT [10][11][12][13].…”
Section: Introductionmentioning
confidence: 99%
“…Unfortunately, lateral bipolar transistors suffer from an intrinsic performance limitation related to base width and the base series resistance. This results in severe performance degradation in terms of current gain (β) and cutoff frequency ( f T ) and makes lateral BJT on SOI inferior to a vertical one [12,13]. Further, the compatibility problems in BiCMOS technology may become further deteriorated by high-temperature post ion implantation annealing of emitter and base regions of BJT.…”
Section: Introductionmentioning
confidence: 99%