A Novel High Density 100kW Three-Phase Silicon Carbide (SIC) Multichip Power Module (MCPM) Inverter

Abstract

The complete design strategy (mechanical and electrical) of a three-phase 100 kW power converter utilizing silicon carbide (SiC) and silicon-on-insulator (SOI) electronics is presented. The design philosophy focuses on size reduction through high temperature operation (200+°C junction temperature). A low power, proof-of-concept prototype operating at 4 kW has been built and tested. The preliminary work renders the 100 kW module 75 % the size of comparable state-of-the art Si converters of the same voltage and power levels. The design approach makes use of the unique advantages of SiC devices while incorporating the necessary passive (capacitive and magnetic) technologies in order to complete a fully functional power module. High power density is obtained through high density integration of the control and power stages using multichip power module (MCPM) technology. The scaling of the low power module to the fully fledged three-phase 100 kW prototype SiC MCPM converter is analyzed in detail.

SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design and Testing for Harsh Environment

“…It took about 50 minutes for the power test system to reach the steady state. With the similar assumption in [7], 25 °C temperature difference from junction to the bottom pad of die is adopted in this paper. In the test, the estimated junction temperature of JFET is about 20 °C higher than that of the diode.…”

“…In [5]- [7], the researchers have designed, developed, packaged, and manufactured a complete multi-chip power module (MCPM) that integrates SiC power transistors with silicon on insulator (SOI) control electronics. They present a new SiC three-phase inverter that has been fully tested to 4 kW at 300 °C operation.…”

Ultra compact, low thermal impedance and high reliability module structure with SiC Schottky Barrier Diodes

“…One of the big benefits with higher frequency application is that the size of passive components can be reduced. As a result, the system size, for example inverter size, can be dramatically reduced [5].…”

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions

“…A 2007 study from Arkansas Power Electronics International (APEI) Inc. (now Wolfspeed, Fayetteville, AR, USA) documented the test results of a 4 kW three-phase power inverter operating at a junction temperature of 250 • C [23]. The design and choice of packaging materials used was a combination of known-good approaches for MCMs using Si IGBTs.…”