2020
DOI: 10.1177/0954405420949106
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A novel high-shear and low-pressure grinding method using specially developed abrasive tools

Abstract: In this work, a novel grinding method using a special abrasive tool was first proposed to achieve high tangential grinding force and low normal grinding force. The abrasive tool was developed with flexible composites to remove workpiece materials under “high-shear and low-pressure” grinding mode. The concept of the high-shear and low-pressure grinding method was introduced in detail. Grinding tests were carried out on a precision grinder with the developed abrasive tool for single crystal silicon specimens. Th… Show more

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Cited by 23 publications
(7 citation statements)
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“…Moreover, the average value of the force ratio reaches the maximum value of 0.82 at 40 Pa·s. The simulation results were compared with the experimental results of Tian and Li [ 32 ]. Under the experimental conditions, the ratio of the tangential force to the normal force under the pure Kevlar fiber grinding condition is 0.357, and the ratio of the tangential force to the normal force is increased to 1.055 by adopting the high-shear low-pressure flexible grinding wheel.…”
Section: Resultsmentioning
confidence: 99%
“…Moreover, the average value of the force ratio reaches the maximum value of 0.82 at 40 Pa·s. The simulation results were compared with the experimental results of Tian and Li [ 32 ]. Under the experimental conditions, the ratio of the tangential force to the normal force under the pure Kevlar fiber grinding condition is 0.357, and the ratio of the tangential force to the normal force is increased to 1.055 by adopting the high-shear low-pressure flexible grinding wheel.…”
Section: Resultsmentioning
confidence: 99%
“…The principle of HSLP grinding using the liquid-body-armor-like wheel is illustrated in Figure 1. 2,40,41,43 The novel wheel consisted of a wheel substrate and an abrasive layer. The abrasive layer was made of the shear thickening fluid, abrasive particles, woven polymer polyethylene fiber, and other chemical additives.…”
Section: Hslp Grinding Principlementioning
confidence: 99%
“…39 In order to increase tangential force and reduce normal force during the grinding process, the high-shear and low-pressure (HSLP) grinding method with a liquid-body-armor-like abrasive tool was proposed for machining the single crystal silicon in our previous studies. 40 The fumed silica (SiO 2 ) was used as both the dispersion phase of the shear thickening fluid and abrasive particles in the fabrication of the grinding wheel. However, the hardness of the fumed silica was too low to effectively cut the Inconel718 material.…”
Section: Introductionmentioning
confidence: 99%
“…In common grinding hardening process, the grinding depth and feeding speed are the routine process variables that have impact on the manufacturing effect. 13,14 Therefore, the grinding depth and feeding speed are selected as the experimental factor. In order to improve the efficiency of experiment, the given different grinding depth and feeding speed are selected to carry on partial orthogonal experiment.…”
Section: Selection Of Experimental Factormentioning
confidence: 99%