2019 IEEE International Electron Devices Meeting (IEDM) 2019
DOI: 10.1109/iedm19573.2019.8993614
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A novel integration of STT-MRAM for on-chip hybrid memory by utilizing non-volatility modulation

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Cited by 15 publications
(8 citation statements)
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“…We keep monitoring the film thicknesses periodically to ensure 2% of wafer-to-wafer variations. Overall film stacks, especially for the MgO tunneling barrier/CoFeB interfaces, are well stacked with sharp interfaces confirmed by the TEM [46] thanks to the surface treatment by the chemical mechanical polishing process. Detailed information of the integration procedures and isolated device performance can be found in our-previous work [46] .…”
Section: Methodsmentioning
confidence: 67%
See 1 more Smart Citation
“…We keep monitoring the film thicknesses periodically to ensure 2% of wafer-to-wafer variations. Overall film stacks, especially for the MgO tunneling barrier/CoFeB interfaces, are well stacked with sharp interfaces confirmed by the TEM [46] thanks to the surface treatment by the chemical mechanical polishing process. Detailed information of the integration procedures and isolated device performance can be found in our-previous work [46] .…”
Section: Methodsmentioning
confidence: 67%
“…In our previous work, we successfully integration isolated SOT-MTJs in a 200 mm-wafer R&D platform, achieving uniform electrical and magnetic performance across the wafer [46] . In addition, high endurance of up to 10 12 cycles was achieved for the fabricated isolated SOT-MTJs [28,46] . Building upon this achievement, we further integrated the SOT-MTJs into an array in conjunction with CMOS in the 200 mm wafer.…”
Section: Introductionmentioning
confidence: 99%
“…At this scaled ∆ and I r , the read latency can also be scaled by adjusting the sense amplifier reference voltage [6], [18]. Equation (15) implies that at scaled ∆, the shortened read pulse duration will also ensure that the Read Disturb rate is within the acceptable target.…”
Section: Optimizing Stt-mram For Ai Acceleratorsmentioning
confidence: 99%
“…These memories have high read/write current densities as compared to conventional CMOS memory technologies such as the Static Random Access Memory (SRAM) and hence are more susceptible to EM effects. In this work, we focus on EM analysis in the STT-MRAM technology since it is more mature as shown by several recent industrial demonstrations [14][15][16][17].…”
Section: A Spintronic Memory Technologymentioning
confidence: 99%