Proceedings of 1994 VLSI Technology Symposium
DOI: 10.1109/vlsit.1994.324422
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A novel method for extracting the two-dimensional doping profile of a sub-half micron MOSFET

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Cited by 11 publications
(8 citation statements)
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“…Examples of the combined use of electrical simulations and C-V measurements to assess the doping profile of certain semiconductor devices have already been presented in literature. For example, Khalil et al 1,2 have successfully applied the technique to determine the two-dimensional doping profile of a submicron MOSFET. However, the implementation of an inverse modeling is strictly related to the type of device and to its structure.…”
Section: Electrical Simulation Yesmentioning
confidence: 99%
“…Examples of the combined use of electrical simulations and C-V measurements to assess the doping profile of certain semiconductor devices have already been presented in literature. For example, Khalil et al 1,2 have successfully applied the technique to determine the two-dimensional doping profile of a submicron MOSFET. However, the implementation of an inverse modeling is strictly related to the type of device and to its structure.…”
Section: Electrical Simulation Yesmentioning
confidence: 99%
“…The combined use of electrical simulations and C-V measurements to obtain the doping profile of a certain semiconductor device is not new in literature. [1][2][3][4][5] However, different implementations are required by the inverse modeling depending on the type of device and on its structure and, to the best of our knowledge, this is the first time such an approach is applied to SPAD modeling.…”
Section: Inverse Modelingmentioning
confidence: 99%
“…The modeling of 2-dimensional dopant diffusion in these devices relies on the calibration of models using both SIMS and 2-dimensional physical characterization techniques, i.e., electron holography or scanning spreading resistance microscopy. The inverse modeling method for the extraction of 2-D dopant concentration in devices was first proposed using electrical device characteristics by Khalil et al, 6 and later extended by Hayashi et al 7 We report on direct observation of p-n junctions with and without a carbon co-implant in 45 nm CMOS n-FET devices by 2-D TEM off-axis electron holography and SIMS. In this work, an inverse modeling method was used to extract the active 2-D dopant distribution from the electron holography data in each device.…”
Section: Introductionmentioning
confidence: 95%