2021
DOI: 10.1109/jeds.2021.3097390
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A Novel SiC Asymmetric Cell Trench MOSFET With Split Gate and Integrated JBS Diode

Abstract: A novel high performance SiC asymmetric cell trench MOSFET with split gate (SG) and integrated junction barrier schottky (JBS) diode (SGS-ATMOS) is proposed for the first time. The shielding effect provided by the SG structure not only reduces the gate-drain capacitance (C gd ) but also alleviates the electric field crowding in the dielectric layer at trench corner. The integrated trench JBS diode bypasses the PiN body diode while obtaining good double protection from the SG and p-type shielding region. Theref… Show more

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Cited by 19 publications
(12 citation statements)
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“…1(a). [30,31] Figure 1(b) shows a schematic cross-section view of the improved SGHJD-TMOS. To facilitate the comparison between the CA-TMOS and SGHJD-TMOS, except for the parameters of the spilt gate and heterojunction freewheeling diode, other configurable factors are consistent with the CA-TMOS.…”
Section: Device Structure and Mechanismmentioning
confidence: 99%
“…1(a). [30,31] Figure 1(b) shows a schematic cross-section view of the improved SGHJD-TMOS. To facilitate the comparison between the CA-TMOS and SGHJD-TMOS, except for the parameters of the spilt gate and heterojunction freewheeling diode, other configurable factors are consistent with the CA-TMOS.…”
Section: Device Structure and Mechanismmentioning
confidence: 99%
“…And it can also be seen that the switching speed of HJD-SG-MOS is much faster than Con-MOS. The turn-on energy loss and turn-off energy loss can be calculated by the integration of Ids×V ds and turn-on delay time or turn-off delay time, respectively [15]. Fig.…”
Section: B Comparison Between Two Structuresmentioning
confidence: 99%
“…However, the use of SG MOSFET will usually increase the resistance of the device under the same cell size [11]- [13], and make the electric field crowding in the gate oxide under high voltage [26], which will affect the reliability of the device for long-term use. The values of HF-FOM (Crss×Ron,sp) and HF-FOM 2 (Qgd×Ron,sp) are usually compared to measure the performance of the device under high-frequency operation [14]- [15]. These values are not only related to the Crss and Qgd, but also related to the specific on-resistance (Ron,sp).…”
Section: Introductionmentioning
confidence: 99%
“…Yang et al [19] investigated a novel SiC UMOSFET by using a deep p + shielded region and current spreading layer. Besides, the stepped oxide, [20][21][22] split-gate (SG), [23][24][25] and thick bottomoxide structure [26][27][28] have been proposed to further improve the compromise relationship between E ox and R on,sp .…”
Section: Introductionmentioning
confidence: 99%