2007
DOI: 10.1109/tmech.2007.897275
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A Novel Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing

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Cited by 99 publications
(43 citation statements)
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“…There are even cases of classical neural network usage [31]. This can easily be generalized to any process and really deserve to be better known.…”
Section: Virtual Metrology For Allmentioning
confidence: 99%
“…There are even cases of classical neural network usage [31]. This can easily be generalized to any process and really deserve to be better known.…”
Section: Virtual Metrology For Allmentioning
confidence: 99%
“…Hung et al [6] based on RBFN to develop a VM model for predicting CVD (Chemical Vapor Deposition) thickness in semiconductor manufacturing. Imai and Kitabata [7] developed a VM model to perform fault detection and classification for preventing copper interconnection from failure in SOC (System on Chip).…”
Section: Related Workmentioning
confidence: 99%
“…Most VM systems in the existing VM-related literature (such as Refs. [6][7][8][9][10][11][12][13]) did not address the plant-wide VM deployment issue.…”
Section: Related Workmentioning
confidence: 99%
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“…Semiconductor fabrication facilities (fabs) can only maintain competitive advantages by effectively controlling process variation, fast yield ramp up, and quick response to yield excursion, especially when the complexity of the process and product increase rapidly. In particular, most of applications using various data mining technologies included root cause identification [8,9], process improvement [10], defect pattern diagnosis [11], equipment backup control [12], cycle time prediction [13,14], demand forecast [15,16], and virtual metrology [17,18]. Most applications are yield improvement for wafer manufacturing and test phase.…”
Section: Semiconductor Phase and Datamentioning
confidence: 99%