A Plate Produced by Nonmetallic Materials of Pulverized Waste Printed Circuit Boards

Abstract

Noble metals and Cu mainly are recycled in treating waste printed circuit boards (PCBs), and a large amount of nonmetallic materials in PCBs are disposed of by combustion or landfill, which may cause secondary pollution and resource-wasting. In this study, a kind of nonmetallic plate (NMP) has been produced by nonmetallic materials of pulverized waste PCBs. The NMP is produced by a self-made hot-press former through adding resin paste as a bonding agent. Furthermore, microshapes of nonmetallic materials and effects of the contents and particle sizes of nonmetallic materials on mechanical properties of the NMP are investigated. It has been found that the nonmetallic materials with particle size from 0.3 to 0.15 mm are in the form of fiber bundles, with the majority of fibers being encapsulated in resin. Nonmetallic materials shorter than 0.07 mm consist of single glass fiber and resin powder. When nonmetallic materials content was 20 wt %, the NMP with particle size of nonmetallic materials less than 0.07 mm, has excellent mechanical properties, which results in a flexural strength of 68.8 MPa and a Charpy impact strength of 6.4 kJ/m 2 . This novel technique offers a possibility for recycling of nonmetallic materials of PCBs and resolving the environmental pollutions during recycling of PCBs.

Methyl Methacrylate and Alpha-Methyl Styrene: New Strategy for Synthesis of Bloc Copolymers for Use in Potential Biomedical Applications Generated by an Ecologic Catalyst Called Maghnite (Algerian MMT)

“…The IR spectrum of Poly (MMA-b-AMS) exhibited all bands belonging to both blocks. The same results are obtained by Mishra et al [65], H-C. Chiu et al [66], and Xu et al [67]. The structure of the resulting copolymer was confirmed by IR, 1 H-NMR measurements ( Figure 5), which demonstrates PMMA-b-PAMS has essentially been formed.…”

Recycling of non-metallic fractions from waste printed circuit boards: A review

“…In a study carried out by Yokoyama and Iji [36], the NMFs consisted of glass fiber (65 wt%), cured epoxy resin (32 wt%), and impurities (copper: <3 wt%, solder: <0.1 wt%). The residual metal (mainly copper) in the NMFs, which were separated from waste PCBs without mounted electronic parts by using the CES, was characterized by Guo et al [37] and the results are shown in Table 2. In another paper [38], in which air classification was used as a separation process, residual copper, glass fiber and resin, etc.…”

“…UPRs find use in industrial applications because of their good mechanical properties especially when reinforced with fibers or fillers [42]. In order to take full advantage of the NMFs of waste PCBs, Zhenming Xu and his colleagues Jie Guo, Bin Cao, Jiuyong Guo from Shanghai Jiao Tong University have developed a novel technique to produce the non-metallic plate (NMP) by using unsaturated polyester resin as a bonding agent [37,43]. The waste PCBs used in their study are a kind of woven glass fabric copper clad laminate without electronic elements, so the NMFs only consists of Cu.…”

Catalytic Pyrolysis and a Pyrolysis Kinetic Study of Shredded Printed Circuit Board for Fuel Recovery

“…In general, the components of waste PCBs can be divided into metallic fractions and non-metallic fractions. Besides that, PCBs contain significant quantities of metals such as copper (16%), solder (4%), iron and ferrite (3%), and nickel (2%) [1].…”