2012
DOI: 10.1039/c2cc34257j
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A poly(fluorene-thiophene) donor with a tethered phenanthro[9,10-d]imidazole acceptor for flexible nonvolatile flash resistive memory devices

Abstract: A conjugated poly(fluorene-thiophene) donor and a tethered phenanthro[9,10-d]imidazole acceptor (PFT-PI) was used as the active layer in flexible nonvolatile resistor memory devices with low threshold voltages (±2 V), low switching powers (∼100 μW cm(-2)), large ON/OFF memory windows (10(4)), good retention (>10(4) s) and excellent endurance against electric and mechanical stimulus.

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Cited by 76 publications
(37 citation statements)
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“…Previously, several types of flexible nonvolatile memory such as flexible flash memory1314151617, flexible ferroelectric memory1819 and flexible resistive memory20212223242526272829303132333435363738 have been demonstrated. In these previous flexible nonvolatile memories, the smallest radius into which the memory devices can be bent has been limited to several millimeters due to the strain-induced degradation of memory properties40.…”
mentioning
confidence: 99%
“…Previously, several types of flexible nonvolatile memory such as flexible flash memory1314151617, flexible ferroelectric memory1819 and flexible resistive memory20212223242526272829303132333435363738 have been demonstrated. In these previous flexible nonvolatile memories, the smallest radius into which the memory devices can be bent has been limited to several millimeters due to the strain-induced degradation of memory properties40.…”
mentioning
confidence: 99%
“…In particular, high-performance flexible non-volatile memories based on various data storage principles such as resistive type [5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24] , flash 4,[25][26][27][28][29] and ferroelectric [30][31][32][33][34][35][36][37][38][39][40] hold great promise in a variety of emerging applications ranging from mobile computing to information management and communication. While the recent advances in this area are impressive, novel organic materials and electronic device structures that can be tightly rolled, crumpled, stretched, sharply folded and unfolded repeatedly without any performance degradation still need to be developed.…”
mentioning
confidence: 99%
“…[9][10][11][12][13][14] Additionally,the RRAM devices can be fabricated in av ertically stacked multilayer structure that is effective to reduce the devices ize and largely increaset he storage density. [15] To date, variousm aterials such as chalcogenides, [16,17] inorganic oxides, [18][19][20][21][22][23] conjugated polymers, [24,25] and organic molecules [26,27] have been proved to possess resistive switching memory behaviors. Amongt hese materials, organic RRAM has been the most promising because of its intrinsic advantagesi ncluding low-temperature processing, printability, and large scalability.…”
Section: Introductionmentioning
confidence: 99%