Publisher's copyright statement: NOTICE: this is the author's version of a work that was accepted for publication in the Journal of microelectronic engineering. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be re ected in this document. Changes may have been made to this work since it was submitted for publication. A de nitive version was subsequently published in the Journal of microelectronic engineering, 145, 2015, 10.1016/j.mee.2015.03.028 Additional information:
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AbstractThis work presents an investigation into the effect on dynamic response of SU-8 microgrippers due to varying thickness, and subsequent validation via COMSOL Multiphysics simulations and thermal camera profiling during actuation. The tweezer-like microgrippers can easily manipulate, with a high degree of control, cells and particles with diameters as small as 10 µm, without using an impractical operating voltage or generating excessive heat. However, in order to fully exploit the versatility of the devices, their response characteristics must be fully understood as material and/or dimension parameters change. Therefore an investigation took place to determine the effects of device thickness on functionality of the device, including the drive current required to actuate the gripper and the speed of actuation. Furthermore, an infrared camera was used to characterize the thermal response of the device. Finally, a simulation of the temperature profile and deflection dimension has been developed in order to verify the findings and further investigate and predict the effects of design variations.