1990
DOI: 10.1109/24.55873
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A proportional hazards approach to correlate SiO/sub 2/-breakdown voltage and time distributions

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Cited by 26 publications
(11 citation statements)
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“…They include random coefficients models ( [15]) and stochastic process models ( [6]) to name a few. Finally, progressive-stress loading is often used for reliability evaluation of a certain type of capacitors or integrated circuits ( [5]). A fruitful area of future research includes developing progressive-stress ADT plans and comparing their performances with those of step-stress and constant-stress ADT plans.…”
Section: Discussionmentioning
confidence: 99%
“…They include random coefficients models ( [15]) and stochastic process models ( [6]) to name a few. Finally, progressive-stress loading is often used for reliability evaluation of a certain type of capacitors or integrated circuits ( [5]). A fruitful area of future research includes developing progressive-stress ADT plans and comparing their performances with those of step-stress and constant-stress ADT plans.…”
Section: Discussionmentioning
confidence: 99%
“…The statistics of breakdown in insulators have been studied extensively [182-184, 187-189, 719-724] with specific emphasis placed by the semiconductor industry on silicon oxide [8, 48-50, 52, 93, 88, 173, 218, 221, 222, 541, 690, 691, 697, 698, 725-747]. The first breakdown event and the final dielectric breakdown event follow the same statistical distribution and have been associated with the same physical processes [8,83,88,93,173,698,731,733]. The random nature of the breakdown process and its dependence on local atomic structure has led to the concept of multi-modal distributions, with one branch of the TDDB distribution being referred to as the "intrinsic" breakdowns and one or more branches being referred to as "extrinsic" breakdowns [738,[749][750][751].…”
Section: Statistics Of Wearout and Breakdownmentioning
confidence: 98%
“…The statistics of breakdown in insulators have been studied extensively [182-184, 187-189, 719-724] with specific emphasis placed by the semiconductor industry on silicon oxide [8, 48-50, 52, 93, 88, 173, 218, 221, 222, 541, 690, 691, 697, 698, 725-747]. The first breakdown event and the final dielectric breakdown event follow the same statistical distribution and have been associated with the same physical processes [8,83,88,93,173,698,731,733]. The random nature of the breakdown process and its dependence on local atomic structure has led to the concept of multi-modal distributions, with one branch of the TDDB distribution being referred to as the "intrinsic" breakdowns and one or more branches being referred to as "extrinsic" breakdowns [738,[749][750][751].…”
Section: Statistics Of Wearout and Breakdownmentioning
confidence: 99%