A rapid life-prediction approach for solder joints based on modified Engelmaier fatigue model

Pan, Yuxiong; Zhou, Guifa; Wang, Xu; Kuang, Fen

doi:10.1016/j.microrel.2020.113844

Cited by 3 publications

(2 citation statements)

References 10 publications

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“…The approach has been widely applied in various studies of solder joint fatigue life prediction (Darveaux, 2000; Gharaibeh, 2022). The plastic strain of solder joints has also been studied using different models, including Solomon, Engelmaier and Coffin–Manson models (Adeniyi Depiver et al , 2020; Pan et al , 2020). Creep strain is another indicative parameter that has been used to evaluate the fatigue life of solder joints.…”

Section: Introductionmentioning

confidence: 99%

Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints

Apalowo,

Abas,

Muhamed Mukhtar

et al. 2024

SSMT

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Purpose This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue. Design/methodology/approach The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated. Findings Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length. Practical implications This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints. Originality/value The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.

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Section: Introductionmentioning

confidence: 99%

Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints

Apalowo,

Abas,

Muhamed Mukhtar

et al. 2024

SSMT

View full text Add to dashboard Cite

show abstract

“…Another prediction model is the plastic strain-based model, which applies the plastic-fatigue strain of the joint as an indicative damage parameter for predicting the fatigue life of the joint when exposed to cyclic temperature changes. Examples of the models include Solomon, Engelmaier and Coffin–Manson models (Wang and Tang, 2019; Depiver et al , 2020; Pan et al , 2020). The damage-accumulation models have also been developed to investigate solder joints' thermal fatigue failure mechanism (Apalowo et al , 2024; Che Ani et al , 2018).…”

Section: Introductionmentioning

confidence: 99%

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

Apalowo,

Abas,

Che Ani

et al. 2024

SSMT

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Purpose This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling. Design/methodology/approach The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method. Findings The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints. Practical implications Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism. Originality/value Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

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Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling

Apalowo,

Abas,

Mukhtar

et al. 2024

Journal of Electronic Packaging

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This study investigated the thermal fatigue reliability of Ball Grid Array (BGA) solder joints under accelerated thermal cycling, considering the impacts of solder alloy and temperature profile. Applying the Darveaux solder joint reliability assessment, simulations consider lead-based (63Sn37Pb and 62Sn36Pb2Ag) and lead-free (SAC105, SAC305, and SAC405) solder alloys under temperature profiles: 0°C (Tmin) to 100°C (Tmax), -40°C to 85°C, -40°C to 125°C, and -40°C to 150°C. Results indicate that SAC305 exhibited the highest equivalent stress, while 63Sn37Pb demonstrated the highest plastic strain and creep strain energy density. SAC105 displayed the lowest stress and strain parameters. Moreover, increasing the thermal cycling temperature range intensifies stress, strain, and damage parameters, with -40°C to 150°C showing the highest magnitudes. SAC405 exhibited superior thermal fatigue life compared to other alloys, with its cycles to failure outperforming 63Sn37Pb, SAC105, 63Sn36Pb2Ag, and SAC305 by 16832, 11992, 6218, and 3601 cycles, respectively. Lower temperature ranges enhance thermal fatigue life, with 0°C to 100°C recording 8%, 33%, and 53% higher life than -40°C to 85°C, -40°C to 125°C, and -40°C to 150°C, respectively. Notably, higher silver content and lower temperature ranges were associated with increased thermal fatigue life, providing valuable insights for BGA solder joint reliability enhancement.

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A rapid life-prediction approach for solder joints based on modified Engelmaier fatigue model

Cited by 3 publications

References 10 publications

Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints

Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling

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