A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

Liu, J.; Tolvgard, A.; Malmodin, J.; Lai, Zonghe

doi:10.1109/6144.774729

Cited by 98 publications

(39 citation statements)

References 2 publications

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“…One journal paper partly covering environmental impact aspects of a conductive adhesive has been published. 2) Here Liu et al compared a specific Applied Specific Integrated Circuit (ASIC) chip inside a Quad Flat Pack 160 package for surface mounting to the same ASIC chip for flip-chip using an anisotropically conductive adhesive film (ACF). The ACF was made of epoxy containing nickel particles and the bumps on the silicon chip consisted of nickel and gold.…”

Section: Related Workmentioning

confidence: 99%

Screening Life Cycle Assessment of Silver-Based Conductive Adhesive vs. Lead-Based Solder and Plating Materials

et al. 2007

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Conductive adhesives are getting growing attention in the electronics industry as they constitute an alternative to lead-free solders and conventional solders. The purpose of the present research is to compare the 10Sn90Pb solder paste to an epoxy based isotropically conductive adhesive (ICA) containing pure silver. The study is done from a life cycle perspective in Japan using input data from literature and the inventory results are evaluated using the Life cycle Impact assessment Method based on Endpoint modeling (LIME) methodology. The findings are that the silver containing adhesive, excluding platings, are superior to the 10Sn90Pb, and that trade-offs exist between 10Sn90Pb and silver-epoxy ICA. For surface platings palladium dominates the results. Overall, the results are dominated by various lead emissions, the silver resource consumption, and the sulfur oxide emissions from palladium production. The most important research limitations are the representativity of the metal production data and end-of-life scenario. The value of the present study is that so far no LIME-based life cycle impact assessment case study comparing 10Sn90Pb solder paste and silver-epoxy ICA including platings has been reported.

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Section: Related Workmentioning

confidence: 99%

Screening Life Cycle Assessment of Silver-Based Conductive Adhesive vs. Lead-Based Solder and Plating Materials

et al. 2007

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“…Boyd et al reported 6 kg CO 2 e/Si die for a 300-mm 0.775-mm-thick 45-nm node CMOS wafer with 590 gross silicon die (Boyd et al 2009). Compared to Boyd et al (2009), Liu et al (1999 excluded silicon wafer production and infrastructure. Per mass of Si die, the carbon footprints are 9,800 and 30,300 kg CO 2 e/kg for Liu et al (1999) and Boyd et al (2009), respectively.…”

Section: Methodsmentioning

confidence: 97%

“…The latest decades, the electronics industry has undergone tremendous changes due to intense research leading to advanced technology development. However, only a few studies (Liu et al 1999;Nissen 2001) have been published on environmental implications of different micro/nanosystems packaging technologies providing same benefit. A possible reason is the large amounts of data required by the LCA tool of complex electronic products using many technologies.…”

Section: Background Aim and Scopementioning

confidence: 97%

Life cycle assessment of integrated circuit packaging technologies

Andrae

Andersen

2011

Int J Life Cycle Assess

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Background, aim and scope Nanostructured polymer particles are produced to be used in ball grid array (BGA) and chip scale packaging (CSP). The technology could replace conventional BGA and CSP metal balls, and the hypothesis is that the shift could be eco-efficient as polymer core particles increase the reliability. For the first time, these particles are environmentally evaluated. Materials and methods The change in GWP100 and EcoIndicator'99 (H) scores when replacing traditional component packaging, here quad flat pack to BGA/CSP, was explored both on component and printed circuit board assembly (PCBA) level. This was followed by comparisons between BGA packages using different types of metal-plated monodispersed polymer particle (MPP) balls and conventional balls, respectively. Results and discussion For BGAs, the silicon (Si) die dominates CO 2 e emissions, but for Eco-Indicator'99(H), solder balls are not negligible. Excluding the Si die and component assembly, the LFBGA-84 to WCSP-64 would reduce CO 2 e by about 98% and Eco-Indicator'99 (H) by about 90%. Overall, for BGA-256 using same size balls, gold-plated MPP technology decreases the Eco-Indicator'99 (H) score by about 25% compared to Pb-based or Pb-free balls. Gold production dominated GWP100 and EcoIndicator'99 (H) for the gold-plated MPP. Each microsystem is unique, and new environmental impact estimations must be done for the sub-structures of each electronic device. Screening process-sum life cycle assessment (LCA) gives similar understanding of impacts as resource productivity methods. Even though the metal mass per ball is greatly reduced, it is a weak indicator of environmental impacts which are driven by each material's specific environmental characteristics.Conclusions The ball share of the BGA-256 GWP100 and Eco-Indicator'99 (H) score is small, and the BGA/CSP producers can marginally improve the environmental performance by focusing on the balls. On a comparable IC packaging basis, the introduction of WCSP packaging technology implies a significant environmental footprint reduction. On PCBA level, the contribution of BGA balls is negligible. Results for metal-plated MPP BGA balls suggest that gold usage is the key environmental performance indicator of interest. Recommendations and perspectives Even though WCSP clearly reduces the component level impacts, the PCBA (board) level impact could increase as the CSP miniaturisation is paralleled with more PWB layers. This effect should be included in further system expansions. For LCA, in general, update of all LCIA methods, which include ozone depletion, with the latest results for dinitrogen monoxide is needed.

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“…They are already being successfully implemented as package methods for chip-on-glass, chip-on-film for flat panel displays, and chip-on-board for mobile electronics. [2][3][4][5] The ACAs consist of mixtures of conductive particles in an insulating matrix. The anisotropic electrical conductivity of these materials comes from the trapped conductive particles between conductive bumps on the flip chip IC and the corresponding pads on the substrate, and from conductive particles not connecting electrically between pads.…”

Section: Introductionmentioning

confidence: 99%

Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

Yim¹,

Hwang²,

Kim³

et al. 2005

Journal of Elec Materi

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This paper presents the development of new anisotropic conductive adhesives (ACAs) with enhanced thermal conductivity for improved reliability of adhesive flip chip assembly under high current density condition. As the bump size in the flip chip assembly is reduced, the current density through the bump also increases. This increased current density causes new failure mechanisms, such as interface degradation due to intermetallic compound formation and adhesive swelling resulting from high current stressing. This process is found especially in high current density interconnection in which the high junction temperature enhances such failure mechanisms. Therefore, it is necessary for the ACA to become a thermal transfer medium that allows the board to act as a new heat sink for the flip chip package and improve the lifetime of the ACA flip chip joint. We developed the thermally conductive ACA of 0.63 W/m·K thermal conductivity by using a formulation incorporating the 5-µm Ni-filled and 0.2-µm SiC-filled epoxy-based binder system. The current carrying capability and the electrical reliability under the current stressing condition for the thermally conductive ACA flip chip joints were improved in comparison to conventional ACA. This improvement was attributed to the effective heat dissipation from Au stud bumps/ACA/PCB pad structure by the thermally conductive ACA.

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A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

Cited by 98 publications

References 2 publications

Screening Life Cycle Assessment of Silver-Based Conductive Adhesive vs. Lead-Based Solder and Plating Materials

Screening Life Cycle Assessment of Silver-Based Conductive Adhesive vs. Lead-Based Solder and Plating Materials

Life cycle assessment of integrated circuit packaging technologies

Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

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