A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions

Mokhtari, Omid

doi:10.1016/j.microrel.2019.04.024

Cited by 63 publications

(25 citation statements)

References 96 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Most of the power module usually needs thermal resistance over 300 • C, while the remained Sn solder melts near 230 • C. Recently, to reduce bonding time in the TLP process, quite a small amount of solder, such as 5 µm in thickness, has been suggested. Most of the research activities are devoted to the use of various melting point reducing agents in the liquid metal for the isothermal solidification in TLP bonding [67]. Most widely used meting point depressants are pure C, B, or phosphorus as an interstitial element to reduce the isothermal solidification time [35,64,68].…”

Section: Bonding Timementioning

confidence: 99%

See 1 more Smart Citation

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Kang

Sharma

Jung

2020

Metals

View full text Add to dashboard Cite

Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging.

show abstract

Section: Bonding Timementioning

confidence: 99%

“…Several researchers in the past [67,68] have used Sn foil as an interlayer to join Cu-Sn, Ni-Sn, or Sn-Ag via TLP bonding. Chu et al [69] studied and compared two sandwiched solder systems (Cu/Sn/Cu and Ni/Sn/Ni) for low-temperature wafer bonding at 255 • C for 5 min.…”

Section: Foil Type Interlayersmentioning

confidence: 99%

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Kang

Sharma

Jung

2020

Metals

View full text Add to dashboard Cite

show abstract

“…The high re-melting temperature is due to the formation of peritectic intermetallic compound (IMCs). These IMCs alloys have been attracted considerable researcher attention due to the fact that it can retain high strength to relatively high temperature [3].…”

Section: Introductionmentioning

confidence: 99%

Peritectic Intermetallic Compound (IMC) Morphology of Transient Liquid Phase Solder - A Short Review

Saud

Zan

Said

et al. 2022

J. Phys.: Conf. Ser.

View full text Add to dashboard Cite

Transient Liquid Phase (TLP) has been a potential bonding technique for high temperature application solder alloy. TLP bonding for solder is a soldering method that using a low and high temperature metal layer for solid form solder, and a mixing of low and high temperature metal powder in flux medium, for paste form solder. Transient Liquid Phase bonding process involved thoroughly consumption of low melting point metal into high melting point metal and results in the formation of high temperature melting point peritectic intermetallic compound (IMC) which enables the solder to be soldered at typical low soldering temperature but, the solder connection can be applied in the high temperature application. The morphology of the peritectic IMCs mainly consist two solids, which is primary α as well as peritectic β together with liquid phase at peritectic temperature. The growth formation of those primary α and peritectic β phases has resulted with a variety of possible peritectic microstructure’s morphology as will be discussed further.

show abstract

“…However, their simulations consider neither the latent heat, nor temperaturedependent natures of the materials. Although there are lots of studies on the formation of voids in the solder joints formed by the conventional reflow process or transient liquid phase bonding process [9], the void formation in SPER bonding is yet to be understood.…”

Section: Introductionmentioning

confidence: 99%

Thermo-Mechanical Characteristics and Reliability of Die-Attach Through Self-Propagating Exothermic Reaction Bonding

Liang

Zhong

Robertson

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

View full text Add to dashboard Cite

Self-propagating exothermic reactions (SPER) provide intense localized heat sufficient for bonding metals or alloys with minimal heat excursion to the components, which shows great potential for the die attach in power electronics packaging. However, the reliability of such formed joints is yet to be fully understood owing to a wide range of defects involved in the instantaneous propagating reaction and heating/cooling. In this work, the finite element analysis is performed to understand the thermal transfer and mechanical responses of materials to the SPER bonding for the die attach of Si device onto direct bonded copper (DBC) substrate with Sn-3.0Ag-0.5Cu solder. The simulation has been validated using the temperature distribution in SPER bonding, which shows a good agreement with the actual measured results. Moreover, a systematic investigation on the mechanical responses due to thermal mismatch reveals their effects on the thermal stress of interfaces and bonding reliability. 1

show abstract

A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions

Cited by 63 publications

References 96 publications

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Peritectic Intermetallic Compound (IMC) Morphology of Transient Liquid Phase Solder - A Short Review

Thermo-Mechanical Characteristics and Reliability of Die-Attach Through Self-Propagating Exothermic Reaction Bonding

Contact Info

Product

Resources

About