Thermo-Mechanical Characteristics and Reliability of Die-Attach Through Self-Propagating Exothermic Reaction Bonding

Liang, Shuibao; Zhong, Yi; Robertson, Stuart; Liu, Allan; Zhou, Zhaoxia; Liu, Changqing

doi:10.1109/tcpmt.2021.3108017

Cited by 8 publications

(3 citation statements)

References 29 publications

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“…[1][2][3] Considering their brittleness behavior, solder joints have been identified as the weakest parts, leading to de-functioning of electronic systems if they fail under thermomechanical loadings. [4][5][6] This event is more critical in solder ball grid arrays with miniaturized dimensions. Hence, great efforts have recently been made to evaluate the microstructural features and mechanical response of solder balls subjected to thermal cyclic loadings.…”

Section: Introductionmentioning

confidence: 99%

A Micromechanical Data-Driven Machine-Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue

Kurniawan

Sayed

Luna

et al. 2023

J. Electron. Mater.

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A combination of nanoindentation mapping and machine-earning (ML) modeling has been used to characterize the micro-structural changes in SnPb solder balls exposed to thermal cycling. The model facilitated the microstructural evaluation of solder bumps through the prediction of microscale variations of Young's modulus in the joint zone. The outcomes revealed that the micromechanical data-driven ML model precisely classified the microstructural constituents, i.e., β-Sn and α-Pb, along with the grain boundary (GB) regions. However, some deviations were observed in GB recognition, when the elastic modulus gradient was not sharp enough. The predictive results also revealed that the increase in number of thermal cycles led to stiffening and grain coarsening of α-Pb, while the β-Sn matrix mainly remained stable. Moreover, it was found that the thermal cycling intensified structural heterogeneity in the solder and sharpened the elastic modulus variations at the GB regions. In summary, the outcomes of this study demonstrate the prediction possibility of microstructural features in SnPb solder balls with a predefined thermal cycle numbers, and unfolded the relationship between morphological characteristics and microscale mechanical properties.

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Section: Introductionmentioning

confidence: 99%

A Micromechanical Data-Driven Machine-Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue

Kurniawan

Sayed

Luna

et al. 2023

J. Electron. Mater.

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“…As a typical SPER material, Ni/Al nanofoil has large heat energy (1050-1250 J/g) and a fast propagating speed (7-10 m/s) [5]. Therefore, the electronics packaging processes with typical bonding areas can be completed at microsecond scale by SPER [6]. The SPER-assisted bonding requires a good wettability of solder since the duration of filler in the melted and liquid stage is very short [7].…”

Section: Introductionmentioning

confidence: 99%

“…Therefore, the electronics packaging processes with typical bonding areas can be completed at microsecond scale by SPER [6]. The SPER-assisted bonding requires a good wettability of solder since the duration of filler in the melted and liquid stage is very short [7]. It demands careful consideration to select a 2 suitable brazing alloy and bonding conditions for SPERassisted bonding.…”

Section: Introductionmentioning

confidence: 99%

Bonding with brazing alloys as high-temperature interconnection filler through self-propagating exothermic reaction

Liu,

Zhou,

Liu

2023

IMAPSource Proceedings

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There has been growing interest in wide bandgap (WBG) semiconductors including SiC and GaN due to the increasing demands for electronic devices serving at high temperatures. However, to maximise the potential capacity of WBG devices, new high-temperature interconnection materials and processes are indispensable as the current existing Sn-based solder alloys and bonding processes developed for Si devices are unable to meet the reliability requirements. In the present work, reactive brazing alloys including Cu-15Ag-5P and Incusil (Ag-27.25Cu-12.5In-1.25Ti) with melting points above 600°C have been utilized as the interconnection materials which offer excellent properties under high operation temperature. The self-propagating exothermic reaction (SPER) was applied for the bonding process via an intense rapid local heating and cooling at a millisecond scale. The strong Cu/Cu-15Ag-5P/Cu and Cu/Incusil/Cu sandwich bonded structures have been created with the assistance of SPER, where the nanofoil was applied from the outside of stacked structures as an external heat source and the bonding process was conducted in the ambient atmosphere without using flux. It has been found that the P element in Cu-15Ag-P alloy has the self-flux effect, which is beneficial for the ultra-fast interfacial reaction process. The experiments where the nanofoil was placed inside of stacked structures between two sheets of brazing alloys have also been conducted, which exhibited the well-bonded interface microstructures between nanofoil and brazing alloys. The outlook on the design for practicality and industrial uses for SPER-assisted bonding with brazing alloys has also been discussed, as a potential viable assembly route for the high-temperature and high-power electronics packaging.

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Simulation of Heat Transfer and Propagation Velocity for Different Heat Loss Conditions for Guided Propagation Fronts in Reactive Multilayer Foils

Daneshpazhoonejad,

Shekhawat,

Döll

et al. 2024

Adv Eng Mater

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Engineering self‐propagating reactions in reactive material systems requires an understanding of critical ignition and propagation conditions. These conditions are governed by the material properties of the reactive materials responsible for net heat generation, as well as by external environmental conditions that primarily determine net heat loss. In this study, it is aimed to utilize a numerical model to investigate the critical conditions for reaction propagation based solely on the heat‐transfer equation, enabling thorough examination with significantly low computational effort. Comparing simulations with experiments demonstrates a high level of agreement in predicting reaction propagation. Additionally, this numerical model provides valuable information regarding heat distribution in substrate materials.

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Thermo-Mechanical Characteristics and Reliability of Die-Attach Through Self-Propagating Exothermic Reaction Bonding

Cited by 8 publications

References 29 publications

A Micromechanical Data-Driven Machine-Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue

A Micromechanical Data-Driven Machine-Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue

Bonding with brazing alloys as high-temperature interconnection filler through self-propagating exothermic reaction

Simulation of Heat Transfer and Propagation Velocity for Different Heat Loss Conditions for Guided Propagation Fronts in Reactive Multilayer Foils

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