A review of graphene reinforced Cu matrix composites for thermal management of smart electronics

Ali, Saad Mahmood; Ahmad, Faiz; Yusoff, Puteri Sri Melor Megat; Muhamad, Norhamidi; Oñate, Eugenio; Raza, Muhammad Qamar; Malik, Khurshid

doi:10.1016/j.compositesa.2021.106357

Cited by 71 publications

(20 citation statements)

References 177 publications

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“…Although graphene possesses a high k , the actual thermal performances of graphene-reinforced Cu matrix composites are not as remarkable as expected (generally <500 W/m K) . Because of the significant heat conduction anisotropy of two-dimensional materials, the orderly and directional arrangement of graphene in a matrix is required to take full advantage of its superb thermal conducting property.…”

Section: Introductionmentioning

confidence: 97%

Superior Thermal Conductivity of Graphene Film/Cu-Zr Alloy Composites for Thermal Management Applications

Guo

Wang

Zhang

et al. 2022

ACS Appl. Mater. Interfaces

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As the power density of electronic devices continuously increases, there is a growing demand to improve the heat conduction performance of thermal management materials for addressing heat dissipation issues. Single-/few-layer graphene is a promising candidate as a filler of a metal matrix due to its extremely high thermal conductivity (k); however, the well-arranged assembly of 2D-component graphene with a high volume fraction remains challenging. Herein, we integrated a novel graphene-based macroscopic material of graphene film (GF) into a Cu matrix by infiltrating molten Zr-microalloyed Cu into a spirally folded and upright-standing GFs skeleton. The microstructure of the GF/Cu composites was regulated by an interface modification strategy. The GF/Cu composites with a spirally layered microstructure exhibit a superior k of 820 W/m K in the axial direction, much higher than that of Cu-matrix composites reinforced with graphene nanosheets (generally <500 W/m K) and twice that of Cu. The thermal transfer mechanisms were investigated by experiments and theoretical calculations. The results reveal that the excellent performance is attributed to the construction of high-heat conduction channels and a positive coordinating effect at the Zr-modified GF/Cu interface. Meanwhile, the relation between interfacial microstructure and heat transfer is established in the composites using interfacial thermal resistance as a bridge. This work yields in-depth insight into the heat conduction mechanism in highly oriented structures and provides a promising solution for the thermal management issues of high-power electronics.

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Section: Introductionmentioning

confidence: 97%

Superior Thermal Conductivity of Graphene Film/Cu-Zr Alloy Composites for Thermal Management Applications

Guo

Wang

Zhang

et al. 2022

ACS Appl. Mater. Interfaces

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“…Many types of films with high thermal conductivities have been designed and fabricated based on horizontally distributed graphene particles [ 26 , 27 , 28 , 29 ]. These thermally conductive films effectively transfer the localized heat from integrated circuits to the surroundings [ 30 ]. However, because of the poor thermos ability of the resin matrix, such films cannot withstand the high temperatures of hundreds of degrees.…”

Section: Introductionmentioning

confidence: 99%

Design and Preparation of Localized Heat-Resistant Coating

Lin

Chen²,

Ma³

et al. 2022

Polymers

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Localized heat sources, such as flame guns and high-energy lasers, can cause severe damage to conventional materials. In this study, a novel localized heat-resistant coating with a high in-plane thermal conductivity was designed and prepared. Reduced graphene oxide (rGO) effectively improved the in-plane thermal conductivity of the polyvinyl alcohol (PVA) film, while maintaining the thermal insulation of the resin matrix in the through-plane direction. This characteristic of the rGO/PVA film was combined with the thermal insulation of boron-modified phenolic resin (BPF), and the prepared composite coating with two layers of rGO/PVA films effectively lowered the back-surface temperature in the flame ablation test from 151 to 107 °C. In addition, the area of the ablation-affected region of coating was increased to 103.6 cm2 from 31.9 cm2, indicating an excellent heat transfer performance. The layer-by-layer structure could realize the compatibility of high in-plane thermal conductivity and good through-plane thermal insulation. The synergy of these two different characteristics is demonstrated to be the key to improving the localized heat-resistant performance of the composite coating. This study effectively expands the application range of high-conductive film, and the obtained coating could act as a shield against butane flame, high energy lasers, and other localized heat.

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“…At present, the reinforcing components that are added to the copper composite are mainly oxide and carbide particles. It has been shown that the mechanical properties will then be significantly improved while the electrical conductivity is still reduced to a certain extent [ 2 ]. The reason is that the conductivity of these reinforcement materials is not high.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Properties of a Graphene Reinforced Cu–Cr–Mg Composite

et al. 2022

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To improve the graphene/copper interfacial bonding and the strength of the copper matrix, Cu–Cr–Mg alloy powder and graphene nanosheets (GNPs) have been used as raw materials in the preparation of a layered graphene/Cu–Cr–Mg composite through high-energy ball-milling and fast hot-pressing sintering. The microstructure of the composite after sintering, as well as the effect of graphene on the mechanical properties and conductivity of the composite, are also studied. The results show that the tensile strength of the composite material reached a value of 349 MPa, which is 46% higher than that of the copper matrix, and the reinforcement efficiency of graphene is as large as 136. Furthermore, the electrical conductivity of the composite material was 81.6% IACS, which is only 0.90% IACS lower than that of the copper matrix. The Cr and Mg elements are found to diffuse to the interface of the graphene/copper composite during sintering, and finely dispersed chromium carbide particles are found to significantly improve the interfacial bonding strength of the composite. Thus, graphene could effectively improve the mechanical properties of the composite while maintaining a high electrical conductivity.

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A review of graphene reinforced Cu matrix composites for thermal management of smart electronics

Cited by 71 publications

References 177 publications

Superior Thermal Conductivity of Graphene Film/Cu-Zr Alloy Composites for Thermal Management Applications

Superior Thermal Conductivity of Graphene Film/Cu-Zr Alloy Composites for Thermal Management Applications

Design and Preparation of Localized Heat-Resistant Coating

Microstructure and Properties of a Graphene Reinforced Cu–Cr–Mg Composite

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