A Silicon Micromachined Eight-Pixel Transceiver Array for Submillimeter-Wave Radar

Reck, Theodore; Jung-Kubiak, Cecile; Siles, José V.; Lee, Choonsup; Lin, Robert; Chattopadhyay, Goutam; Mehdi, Imran; Cooper, Ken B.

doi:10.1109/tthz.2015.2397274

Cited by 84 publications

(35 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…By taking advantage of micromaching processes that yield high accuracy and repeatability in shape and dimensions, packages can be formed with multiple silicon pieces for more complex structures [89], [110], [112], [120], [121]. In general, metallic blocks are designed to make the RF signals flow in the plane on the split surface.…”

Section: A Silicon Micromachiningmentioning

confidence: 99%

Packages for Terahertz Electronics

Song

2017

Proc. IEEE

112

View full text Add to dashboard Cite

| In the last couple of decades, solid-state device technologies, particularly electronic semiconductor devices, have been greatly advanced and investigated for possible adoption in various terahertz (THz) applications, such as imaging, security, and wireless communications. In tandem with these investigations, researchers have been exploring ways to package those THz electronic devices and integrated circuits for practical use. Packages are fundamentally expected to provide a physical housing for devices and integrated circuits (ICs) and reliable signal interconnections from the inside to the outside or vice versa. However, as frequency increases, we face several challenges associated with signal loss, dimensions, and fabrication. This paper provides a broad overview of recent progress in interconnections and packaging technologies dealing with these issues for THz electronics. In particular, emerging concepts based on commercial ceramic technologies, micromachining, and 3-D printing technologies for compact and lightweight packaging in practical applications are highlighted, along with metallic split blocks with rectangular waveguides, which are still considered the most valid and reliable approach.

show abstract

Section: A Silicon Micromachiningmentioning

confidence: 99%

Packages for Terahertz Electronics

Song

2017

Proc. IEEE

112

View full text Add to dashboard Cite

show abstract

“…Waveguide components working in the millimeter-wave (mmW) and sub-mmW frequency ranges of the electromagnetic spectrum are of particular interest for many applications due to their high performance and reduced size [1]. Silicon micromachining of waveguide components and systems in this frequency range enables high-complexity, high-performance, and drastically miniaturized devices [2][3][4]. Although silicon-micromachined waveguide devices are usually substantially smaller than waveguide flanges, it is often necessary to connect them to such flanges in specific system architectures, or solely for their characterization.…”

Section: Introductionmentioning

confidence: 99%

Micromachined Waveguide Interposer for the Characterization of Multi-port Sub-THz Devices

Gomez-Torrent

Oberhammer

2020

J Infrared Milli Terahz Waves

View full text Add to dashboard Cite

This paper reports for the first time on a micromachined interposer platform for characterizing highly miniaturized multi-port sub-THz waveguide components. The reduced size of such devices does often not allow to connect them to conventional waveguide flanges. We demonstrate the micromachined interposer concept by characterizing a miniaturized, three-port, 220-330-GHz turnstile orthomode transducer. The interposer contains low-loss micromachined waveguides for routing the ports of the device under test to standard waveguide flanges and integrated micromachined matched loads for terminating the unused ports. In addition to the interposer, the measurement setup consists of a micromachined square-to-rectangular waveguide transition. These two devices enable the characterization of such a complex microwave component in four different configurations with a standard two-port measurement setup. In addition, the design of the interposer allows for independent characterization of its sub-components and, thus, for accurate de-embedding from the measured data, as demonstrated in this paper. The measurement setup can be custom-designed for each silicon micromachined device under test and co-fabricated in the same wafer due to the batch nature of this process. The solution presented here avoids the need of CNC-milled test-fixtures or waveguide pieces that deteriorate the performance of the device under test and reduce the measurement accuracy.

show abstract

“…Existing micromachining techniques and infrastructure enable batch production, with billions of silicon-micromachined components in use today. Vertically-stacked silicon-micromachined packages in [58], [59] utilised thin active devices (≤ 25 µm), which are both too costly and overly fragile for volume manufacturing. This work seeks to merge SiGe MMICs with siliconmicromachined waveguides for the first time to realise lowcost, volume-manufacturable THz devices and systems.…”

Section: Introductionmentioning

confidence: 99%