A simple model of emi-induced timing jitter in digital circuits, its statistical distribution and its effect on circuit performance

Robinson, M.P.; Fischer, Katharina; Flintoft, Ian D.; Marvin, A.C.

doi:10.1109/temc.2003.815529

Cited by 31 publications

(12 citation statements)

References 7 publications

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“…Looking at the bottom of Figure 2 it can be seen that the shape of the double peak around the undisturbed value is very close to the PDF of a sine wave. The PDF p(x) of a sine wave with unit amplitude can be described by the following equation [3]:…”

Section: Measurement Results and Analysismentioning

confidence: 99%

“…Furthermore we shall compare the behaviour of the ADC with a track attached to an ADC with no track attached when exposed to higher field strengths, which should be achievable by using the IC stripline method [4]. Further tests with modulated interference signals with known PDFs [3] would allow us to verify that the histogram bins around the undisturbed ADC value always reflect the PDF of the disturbance signal.…”

Section: Future Workmentioning

confidence: 99%

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Defining a measure for the immunity of analogue to digital converters exposed to electric fields

Aurand

Dawson

Robinson

et al. 2008

2008 IEEE International Symposium on Electromagnetic Compatibility

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The paper describes a method to measure the error in samples of an analogue to digital converter when exposed to RFI. Rather than defining a change from an undisturbed value as an error alone, we will show that both 'ordinary' bit errors as well as the shape of the histogram around the undisturbed value can to be taken into account. How these errors can be measured and why the two types have to be dealt with separately is explained.

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Section: Measurement Results and Analysismentioning

confidence: 99%

Section: Future Workmentioning

confidence: 99%

Defining a measure for the immunity of analogue to digital converters exposed to electric fields

Aurand

Dawson

Robinson

et al. 2008

2008 IEEE International Symposium on Electromagnetic Compatibility

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“…In general, the total field consists of four terms (9) where is the direct coupling between the transmission and reception antennas, is the unmodulated portion of the field, which has scattered from passive structures in the EUT, is the scattered field that has interacted with digital circuits, and is the active radiated emissions of the EUT. From (2), contains the scattered carrier term and the modulation sidebands .…”

Section: Measurement Methodologymentioning

confidence: 99%

“…9(b). The statistical distribution of the timing jitter is also asymmetric which would also tend to generate even CMPs in the re-emission spectrum [9].…”

Section: A Changes In Timing Jittermentioning

confidence: 99%

The re-emission spectrum of digital hardware subjected to emi

Flintoft

Marvin

Robinson

et al. 2003

IEEE Trans. Electromagn. Compat.

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Article:Flintoft, I D orcid.org/0000-0003-3153-8447, Marvin, A C orcid.org/0000-0003-2590-5335, Robinson, M P orcid.org/0000-0003-1767-5541 et al. (2 more Abstract-The emission spectrum of digital hardware under the influence of external electromagnetic interference is shown to contain information about the interaction of the incident energy with the digital circuits in the system. The generation mechanism of the re-emission spectrum is reviewed, describing how nonlinear effects may be a precursor to the failure of the equipment under test. Measurements on a simple circuit are used to demonstrate how the characteristics of the re-emission spectrum may be correlated with changes to the digital waveform within the circuit. The technique is also applied to a piece of complex digital hardware where similar, though more subtle, effects can be measured. It is shown that the re-emission spectrum can be used to detect the interaction of the interference with the digital devices at a level well below that which is able to cause static failures in the circuits. The utility of the technique as a diagnostic tool for immunity testing of digital hardware, by identifying which subsystems are being affected by external interference, is also demonstrated.

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“…Consequently, a decrease in the noise margins appears. In addition, the proximity on the silicon die of digital and analog parts leads to higher electromagnetic interferences inducing functional failures (such as overvoltages, voltage drops on supply lines, or code errors) [10][11][12].…”

Section: Contextmentioning

confidence: 99%